Metal Deposition

NOVA offers Sputtered PVD Metal Deposition services designed to deposit ultra-clean metal films with quick turn times at affordable prices.

Sputtered Metals Thickness Diameter
Al (Aluminum) 250 - 20,000Å 2" - 12"
AlCu (Aluminum/Copper) 250 - 20,000Å 2" - 12"
AlSi (Aluminum/Silicon) 250 - 20,000Å 2" - 12"
Cu (Copper) 250 - 20,000Å 2" - 12"
Ti (Titanium) 250 - 3,000Å 2" - 12"
Ta (Tantalum) 250 - 3,000Å 2" - 12"
Cr (Chrome) 250 - 3,000Å 2" - 12"
W (Tungsten) 250 - 3,000Å 2" - 12"
TiW (Titanium Tungsten) 200 - 3,000 Å 2" - 12"
TiN (Titanium Nitride) 200 - 3,000 2" - 12"
TaN (Tantalum Nitride) 200 - 2,000 Å 2" - 12"

The E-Beam Evaporation process allows for excellent film thickness control and can deposit up to six different materials in-situ. E-Beam Evaporation is a great option for precious metal deposition requirements and an excellent choice for wafers that require lift-off processing.

Evaporated Metals Thickness Diameter
Al (Aluminum) 100 - 5,000Å 2" - 8"
Cu (Copper) 100 - 3,000Å 2" - 8"
Cr (Chrome) 100 - 3,000Å 2" - 8"
Sn (Tin) 100 - 3,000Å 2" - 8"
Ti (Titanium) 100 - 3,000Å 2" - 8"
Ag (Silver) 100 - 10,000Å 2" - 8"
Au (Gold) 100 - 10,000Å 2" - 8"
Pt (Platinum) 100 - 10,000Å 2" - 8"
ITO (Indium Tin Oxide) 100 - 1,000Å 2" - 8"

Contact NOVA for more information phone us at (972)478-7002 or submit an online Service Request.


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