1"-2" Wafer Listing
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SAP-14781
5
1"
Sapphire
430±25
DSP
wafer with No Flat
A02-17534
29
1"
Germanium
300±25
DSP
Wafer with 1 Std. Flat
8376
100
2"
N
<100>
1
10
254
305
Prime
w/Primary Flat Only
8289
215
2"
P
<100>
1
10
254
306
Prime
w/ Primary Flat only.
8289-AS
13
2"
P
<100>
1
10
254
306
Prime
w/ Primary Flat only , Backside 2D Barcode Laser Mark & 3500 A° Thermal Oxide
CA02-10016
38
2"
N+
<100>
350±25
GaAs
Wafer
CA03-12715
38
2"
SI
<100>
350±25
GaAs
Wafer
BC28629
1000
2"
Any
<Any>
Any
495
521
Lapped
ER
WC11081
300
2"
N/As
<111>±.5°
.001
.005
254
304
Prime
SSP w/Primary Flat Only
7244-232
50
2"
P/Bo
<100>
.001
.005
254
305
2" P/Bo <100> .001-.005 ohm-cm 254-305µm Thick SSP w/Primary Flat Only
A02-17705
1
2"
P/Ga
<100>
.005
.04
150
200
Ge
Wafer with Primary Flat Only
SAP-14996
100
2"
Sapphire
430±25
DSP
Prime Epi Ready Wafer with Primary Flat Only
SAP-16658
50
2"
Sapphire
430±20
Epi
Ready Wafer w/Primary Flat Only, TTV <10µm, Bow & Warp <=10µm, Ra =<0.3nm
A02-17983
4
2"
Germanium
<110>±1°, LM/Barcode Centered on Backside
2" Germanium C Plane <0001> 1000±25µm Thick SSP Wafer with Primary Flat Only <110>±1°, LM/Barcode Centered on Backside
HS4962210
700
2.5"
N
<100>
.14
.25
Ingot
Ground
3" Wafer Listing
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7395
548
3"
N
<100>
1
10
356
406
Prime
with Primary Flat Only & 3,000 Ang. ±5% Thermal Oxide
8445
75
3"
N
<111>
6
12
245
325
FZ
6-12 ohm-cm 245-325µm Thick Test
BC3032
41
3"
N
<111>
.05
.1
300
406
As-cut
Coin-roll
BC88996
172
3"
N
<111>off3-4°
>.01
356
406
Epi
layer= 7.5-10 ohm-cm 20-25µm
HC40561
21
3"
N
<110>
Any
and
Ge
As-cut Edgerounded Wafer w/2 Flats
WC37192
1925
3"
N
<100>
>20
381
483
Test
with Semi Flats
WC37620-NV
625
3"
N
<100>
1
10
356
406
Prime
w/Primary Flat Only
BC17967
2600
3"
P
<111>
.014
.02
Ingot
Ground & Flatted per U.S. Stds.
WC27806
150
3"
P
<100>
1
10
356
406
Prime
w/2 Semi-Std Flats
7244-1272
2300
3"
P
<111>
<10
Ingot
Ground, Flat & Mounted
BP02-13285
383
3"
P
<100>
1
10
400±10
Etched
Edge-rounded Wafer w/2 Semi-Std. Flats
CP02-11208
100
3"
P
<100>
.001
.005
356
406
Prime
w/2 Semi-Std. Flats
CP17-10041
10200
3"
P
<100>
1
10
Ingot
Ground w/0 Flats or 2 Flats per Semi-Stds.
WC27806-AS
25
3"
P
<100>
1
10
356
406
Prime
w/2 Semi-Std Flats & 6,000 A°±5% Thermal Oxide
BC39650
432
3"
N/As
<111>±.5°
.001
.005
355
405
Prime
SSP w/2 Semi-Std. Flats
7244-2718-923
15900
3"
N/Sb
<111>
.005
.05
Ingot
As-grown Ground & Flatted
CP15-10503
55
3"
Intrinsic
<100>
>10,000
675
725
FZ
>10,000 ohm-cm 675-725µm Thick Prime DSP w/Primary Flat Only, TTV <1µm & Backside LM
4" Wafer Listing
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7329
200
4"
N
<100>
1
100
500
550
DSP
Prime w/Primary Flat Only
BC98787
50
4"
N
<100>
.01
.02
500
550
Prime
w/2 Semi-Std. Flats
HC44002
15
4"
N
<111>
5
40
762
813
Ge
As-cut Wafer
HC44003
46
4"
N
<111>
5
40
889
940
Ge
As-cut Wafer
HC44004
12
4"
N
<Any>
5
40
1016
1067
Ge
As-cut Coin-rolled Wafer
STK8414
950
4"
N
<100>
1
10
500
550
Prime
w/2 Semi-Std. Flats
STK9671-1
425
4"
N
<100>
1
40
475
575
Test
SSP w/Primary Flat only
7244-4682-126A
4000
4"
N
<111>
1
9
Ingot
As-grown Phosphorus doped
CN02-16027
25
4"
N
<100>
1
30
700
750
Prime
SSP w/Primary Flat Only, TTV </=3µm
DN01-11604
375
4"
N
<100>
1
20
390
410
DSP
w/2 Semi-Std Flats
DN03-10624
408
4"
N
<100>
.001
.005
500
550
Prime
w/2 Semi-Std. Flats
STK8414-OX
20
4"
N
<100>
1
10
500
550
Prime
w/2 Semi-Std. Flats & 5000 A°±5% Wet Thermal Oxide
7358
25
4"
P
<100>
10
20
500
550
Prime
SSP w/2 Semi-Std. Flats
7375
525
4"
P
<100>
1
25
475
575
Test
w/2 Semi-Std Flats
7871
175
4"
P
<100>
1
10
500
550
DSP
w/Primary Flat Only, TTV <5µm, Bow <30µm
7375-OX
50
4"
P
<100>
1
25
475
575
Test
w/2 Semi-Std Flats & 10,000 A°±5% Thermal Oxide
BC77213
75
4"
P
<100>
.01
.02
500
550
Prime
w/2 Flats
BC79114
450
4"
P
<100>
1
10
500
550
DSP
w/2 Semi-Std. Flats
GC38892
14087
4"
P
<100>
1.3
3.7
Ingot
Ground 1Flat per U.S. Semi-Stds.
HC49138
4400
4"
P
<111>
.0015
.0035
Ingot
Ground, flatted & mounted
HS19155
9
4"
P
<111>±0.5°
.001
.005
325
375
DSP
Prime w/Primary Flat Only, TTV <1µm
HS39626
1375
4"
P
<100>
.001
.005
500
550
Prime
w/Semi-Std Flats
DP07-095
222
4"
P
<111>±1°
.024
.045
310
330
Prime
ER & Lapped w/Primary Flat Only
SOI11000
7
4"
P
<100>
1
10
280
320
SOI
CZ Handle DSP w/o oxide, Box: 1.4-2.1µm Thermal, Device 1-10 ohm-cm 35-40µm, TTV <10µm
GC38892-2
7140
4"
P
<100>
1.3
4.1
Ingot
Ground 2 Flats per U.S. Semi-Stds.
STK8414-2
975
4"
P
<100>
1
10
500
550
Prime
w/2 Semi-Std. Flats
HS39626-DO
75
4"
P
<100>
.001
.005
500
550
Prime
w/Semi-Std Flats & 2850 A°±5% Dry Thermal Oxide
HS39626-OX
234
4"
P
<100>
.001
.005
500
550
Prime
w/Semi-Std Flats & 2850 A°±5% Dry Chlorinated Thermal Oxide and Forming Gas Anneal
HS39626-WO
325
4"
P
<100>
.001
.005
500
550
Prime
w/2 Semi-Std Flats & 2850 A°±5% Wet Thermal Oxide
HS39626-DO9
100
4"
P
<100>
.001
.005
500
550
Prime
w/Semi-Std Flats & 900 A°±7% Dry Thermal Oxide
4A01-11732
346
4"
x
4" x 4" x 0.70mm Glass Borosilicate Wafer No Bevels, Surface Quality 80/50. (Schott D-263)
HC22001
15
4"
N+
<Any>
.0015
.003
Any
Epi
Layer N w/Any Resistivity & Thickness
7244-6014-859
7500
4"
N+
<100>
Any
Ingot
As-grown, Arsenic doped, Ground & Flatted
4I0-11370
150
4"
Intrinsic
<100>
>10,000
500
550
FZ
>10,000 ohm-cm 500-550µm Thick Prime DSP w/Primary Flat Only
4I20-18291-AS
25
4"
Intrinsic
<100>
>20,000
500
550
FZ
>20,000 ohm-cm 500-550µm Thick SSP Prime w/Primary Flat Only & 2850 A°±5% Dry Thermal Oxide
5" Wafer Listing
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6416M
4009
5"
P
<100>
.087
.092
Ingot
Ground, Flatted w/2 Flats, V-notch on Primary Flat
7244-6691-2B
4100
5"
P
<100>
<.007
Ingot
Ground w/2 Flats
7244-6013-427
2535
5"
N+
<111>
<=.007
Ingot
Ground, Flatted & Mounted, Arsenic doped
7244-6013-633
20524
5"
N+
<111>
.001
.01
Ingot
As-grown Arsenic doped with 3 Flats
AV381894
325
5"
Any
625±25
5" Any Type, Orientation, Resistivity 625±25µm Thick SSP with Primary Flat Only or 2 Std. Flats
6" Wafer Listing
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FA01-9900
4
6"
x.75mm
Pyrex
Transparent wafers with Edge Seam, Round No Flat
WC109484
1500
6"
N
<110>
1
10
Ingot
Ground w/ U.S. Primary Flat Only
GC38892-5
161197
6"
N
<100>
.025
.07396
Ingot
Ground & 1 Flat per U.S. Semi-Stds., Antimony doped
HS39560-2
25
6"
N
<100>
>1000
1143
1169
FZ
>1000 ohm-cm 1143-1169µm Thick DSP w/Primary Flat Only
FN06-10733-AS
50
6"
N
<100>
4
7
600
650
Prime
w/Primary Flat Only, LM, 10,000 A° WTO & 4,000 A° Stoichiometric LPCVD Nitride
FN06-10733
75
6"
N
<100>
1
10
600
700
Prime
w/Primary Flat Only & LM
7447
6
6"
P
<100>
1
20
530
585
Test
with Jeida Flat
7467
50
6"
P
<100>
1
50
600
700
6" P <100> 1-50 ohm-cm 600-700µm Thick SSP w/Primary Flat Only & 3,000 A°±5% Thermal Oxide
BC2234
175
6"
P
<100>
1
100
600
700
Prime
w/Primary Flat Only, LM Optional & 750 A°±10% Thermal Oxide
BC87992
100
6"
P
<100>
1
100
600
700
Test
w/Primary Flat Only & 20,000 A° ± 5% Thermal Oxide
C2TC017
2775
6"
P
<100>
1
100
Test
w/ Primary Flat Only.
GC19060
125
6"
P
<100>
10
30
650
700
Prime
w/Primary Flat Only
HS18730
23
6"
P
<100>
20
30
600
655
6" P <100> 20-30 ohm-cm 600-655µm Thick SSP w/Primary Flat Only
HS18909
1175
6"
P
<100>
1
30
650
700
Prime
w/Std. Notch
HS19222
5
6"
P
<100>off
1
30
700
750
Lapped
w/Primary Flat Only
HS37809
100
6"
P
<100>
1
100
600
700
6" P <100> 1-100 ohm-cm 600-700µm Thick SSP with 10,000 A°± 5% Thermal Oxide
HS77723
7
6"
P
<100>
.005
.025
390
410
Prime
with Primary Flat Only & LM
WC78987
875
6"
P
<100>
1
50
650
700
Prime
w/ Primary Flat Only
FP02-61160
200
6"
P
<100>
.001
.005
650
700
Prime
SSP w/Primary Flat Only
3162085
6000
6"
Any
<Any>
Any
Ingot
As-grown
STK9281
4
6"
Any
<Any>
0
100
Any
Etched
Coinrolled with Primary Flat Only.
WC99755
321
6"
Any
>600
6" Any Type, Orientation, Resistivity >600µm Thick SSP Coinroll w/Primary Flat Only or Notch
FN06-052808
4
6"
SOI
<100> >10 ohm-cm 851±5µm Thick DSP; B
>10
851±5
SOI
with Etch Cavities, Handle: N/P <100> >10 ohm-cm 851±5µm Thick DSP; BOX: 10,000A°, Device: P/N <100> 1-10 ohm-cm, 305±5µm
FN06-052820
8
6"
SOI
<100> 10-30 ohm-cm 665±5µm Thick DS
10
30
665±5
SOI
with etch cavities, Handle: P <100> 10-30 ohm-cm 665±5µm Thick DSP w/Primary Flat, Seq'l LM; Box:10,000 A°±5%, Device: N <100>1-10, 305±5µm
8" Wafer Listing
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IO9433
75
8"
N
<100>
10
40
675
775
8" N <100> 10-40 ohm-cm 675-775µm Thick SSP & 3,000 A° ±5% Thermal Oxide
GN16-12341
150
8"
N
<100>
>5000
700
750
FZ
>5000 ohm-cm 700-750µm Thick Prime SSP with Std. Notch
GN16-17277
400
8"
N
<100>±0.5°
8
10
700
750
FZ
8-10 ohm-cm 700-750µm Thick Prime DSP with US Std. Notch & M12 Laser Mark
IN08-11685
25
8"
N
<100>
1
30
700
750
Prime
SSP w/Std. Notch & 3,000 A° ± 10% Thermal Oxide
5196
775
8"
P
<100>
.005
.01
700
750
8" P <100> .005-.01 ohm-cm 700-750µm Thick SSP w/Notch & LM
ga08
225
8"
P
<100>
.008
.02
700
750
8" P <100> .008-.02 ohm-cm 700-750µm Thick SSP with EPI Layer
7574-2
1300
8"
P
<100>
.01
.03
675
775
8" P <100> .01-.03 ohm-cm 675-775µm Thick SSP w/Std. Notch & Poly Oxide Backseal.
BC9137
85
8"
P
<100>
10
20
705
745
8" P <100> 10-20 ohm-cm 705-745µm Thick SSP w/Semi-Std. Notch, TTV <10µm, Backside LM
HS18288
627
8"
P
<100>
0
50
585
775
Test
w/Notch & 10,000 A° ±5% Thermal Oxide
WC98987
2146
8"
P
<100>
1
50
700
750
Prime
SSP w/Std. Notch & LM
3012007A
50
8"
P
<100>
10
25
700
750
SOI
Wafer Box: 1900-4100 A°, SOI Layer 5-25 ohm-cm 2.6-3.2µm
BC118365
25
8"
P
<100>
1
100
700
750
8" P <100> 1-100 ohm-cm, 700-750µm Thick SSP w/Std. Notch & LaserMark.
GCR11485
200
8"
P
<100>
.5
100
700
750
8" P <100> .5-100 ohm-cm 700-750µm Thick SSP with Notch, Optional LM & 10,000 A°±5% Thermal Oxide
JK-11811
19
8"
P
<100>
1
100
675
775
8" P <100> 1-100 ohm-cm 675-775µm Thick SSP with Std. Notch only.
JK-11817
574
8"
P
<100>
1
100
675
775
8" P <100> 1-100 ohm-cm 675-775µm Thick SSP with Std. Notch only & 3,000A° ±5% Thermal Oxide.
JK-82019
25
8"
P
<100>
4
6
700
750
8" P <100> 4-6 ohm-cm 700-750µm Thick SSP w/Std. Notch & LaserMark
OCR71714
448
8"
P
<100>
.5
100
700
750
8" P <100> .5-100 ohm-cm 700-750µm Thick SSP with Notch, Optional LM & 2,000 A°±5% Thermal Oxide
STK950-2
172
8"
P
<100>
1
100
675
775
Test
w/Std. Notch
STK99500
23
8"
P
<100>
1
10
975
1025
DSP
Prime w/Std. Notch
WC119234
450
8"
P
<100>
Any
650
750
Reclaim
w/Std. Notch & LPD's <30 @ .3µm
7574-2-OX
425
8"
P
<100>
.01
.05
675
775
8" P <100> .01-.05 ohm-cm 675-775µm Thick SSP w/Std. Notch & 3,000 A°±5% Thermal Oxide
STK9500-2
175
8"
P
<100>
1
100
700
750
8" P <100> 1-100 ohm-cm 700-750µm Thick SSP w/Std. Notch
OP00-9833-AS
50
8"
P
<100>
1
100
700
750
8" P <100> 1-100 ohm-cm 700-750µm Thick SSP w/Std. Notch & 500 A°±10% Dry Thermal Oxide
OP03-11146-OX
1474
8"
P
<100>
1
30
675
775
8" P <100> 1-30 ohm-cm 675-775µm Thick SSP with Std. Notch & 3,000 A°±5% Thermal Oxide
GP11-13193
25
8"
P
<111>off4°
4.5
6.5
700
750
Prime
with Notch & Poly Backseal
HP01-T200R
210
8"
P
<100>
0
100
>700
Etched
Edge-rounded Coinroll w/Std. Notch
OP03-11146
3025
8"
P
<100>
1
50
725
750
8" P <100> 1-50 ohm-cm 725-750µm Thick Etch/Etch with Std. Notch
WC10103~P1
1425
8"
P
<100>
3
40
700
750
Prime
SSP w/Std. Notch, optional Lasermark
EG9911
150
8"
SOI
SOI
Soitec Unibond Wafer Si Thickness 1500nm SiO2 1000nm
GA06-13634
350
8"
N/As
<100>
<.005
675
775
8" N/As <100> <.005 ohm-cm 675-775µm Thick SSP with 3,000 A°±5% Thermal Oxide
9911
925
8"
P/Bo
<100>
>10
725±25
DSP
Prime w/ STD. Notch TTV <5µm, Oi <12 ppma, B&W <30µm
GC19195
1775
8"
P/Bo
<100>
0
100
675
775
8" P/Bo <100> 0-100 ohm-cm 675-775µm Thick SSP with Std. Notch & Backside LM
GP26-12991
25
8"
P/Bo
<100>
>1000
710
740
Prime
SSP MCZ w/Semi-std Notch and Low Oxygen (<12ppma) & Low Carbon. FS by SEH.
HBF-11226
413
8"
1.10mm
DSP
Glass Wafer w/ Notch
8SBF-18235
4
8"
Schott
DSP
(60/40) Wafer with Notch
12" Wafer Listing
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STK9754
240
12"
P
<100>
1
100
750
800
DSP
w/Std Notch & LM
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