Silicon Wafer Materials

Silicon wafers are a matter of precision work. Silicon wafers form the basis of the most complex electronic components — from thyristors for high-voltage applications, through low-ohm circuit elements in automotive engineering and telecommunications, to large-scale integrated microprocessors and memory modules for information processing. Our longstanding cooperation and relationships with silicon wafer suppliers, which have grown over the years, have provided us with an in-depth knowledge of our customers and their requirements. Wherever possible, we strive to surpass our customers' expectations through specially tailored products and services. This strong customer orientation is reflected in a high level of appreciation and in our sound relationships with business partners. Please view our partial inventory listing or complete our Request a Quote form for NOVA to supply your needs!

We offer silicon wafer products such as:



If you see an item that you would like us to give you a quote on, check the "Add Cart" boxes. When you have all the items selected that you would like a quote for, click on the Quote Cart button. Please browse through one of our silicon wafer product categories to view our partial inventory for immediate delivery.


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NOVA offers the best competitive pricing without sacrificing quality. No order is too big or too small for us to handle. Contact Us today.






1"-2" Wafer Listing

Top of Page Quote Cart Print 1"-2" Listing
Add   Qty on       Resistivity Thickness  
Cart Item ID Hand Diameter Type Orientation Min. Max. Min. Max. Grade
BP01-14831 75 1" P/Bo <100> 1 100 575 625 Prime
    SSP with No Flat
SAP-14781 5 1" Sapphire 43025 DSP
    wafer with No Flat
8376 100 2" N <100> 1 10 254 305 Prime
    w/Primary Flat Only
8289 175 2" P <100> 1 10 254 306 Prime
    w/ Primary Flat only.
CA02-10016 40 2" N+ <100> 35025 GaAs
    Wafer
CA03-12715 48 2" SI <100> 35025 GaAs
    Wafer
WC11081 50 2" N/As .001 .005 254 304 Prime
    SSP w/Primary Flat Only
7244-232 100 2" P/Bo <100> .001 .005 254 305
    2" P/Bo <100> .001-.005 ohm-cm 254-305µm Thick SSP w/Primary Flat Only
SAP-14996 35 2" Sapphire 43025 DSP
    Prime Epi Ready Wafer with Primary Flat Only
SAP-16658 50 2" Sapphire 43020 Epi
    Ready Wafer w/Primary Flat Only, TTV <10µm, Bow & Warp <=10µm, Ra =<0.3nm
HS4962210 700 2.5" N <100> .14 .25 Ingot
    Ground
 

3" Wafer Listing

Top of Page Quote Cart Print 3" Listing
Add   Qty on       Resistivity Thickness  
Cart Item ID Hand Diameter Type Orientation Min. Max. Min. Max. Grade
7395 300 3" N <100> 1 10 356 406 Prime
    with Primary Flat Only & 3,000 Ang. ±5% Thermal Oxide
8445 125 3" N <111> 6 12 245 325 FZ
    Test
BC3032 41 3" N <111> .05 .1 300 406 As-cut
    Coin-roll
BC4025 500 3" N <100> 1 100 275 325 DSP
    Prime with 2/ Semi-Std. Flats
BC88996 172 3" N >.01 356 406 Epi
    layer= 7.5-10 ohm-cm 20-25µm
HC40561 21 3" N <110> Any and Ge
    As-cut Edgerounded Wafer w/2 Flats
WC37192 975 3" N <100> >20 381 483 Test
    with Semi Flats
CN01-10274 350 3" N >3000 355 405 FZ
    Prime w/Primary Flat Only & LM
WC37620-NV 150 3" N <100> 1 10 356 406 Prime
    w/Primary Flat Only
7244-69 1400 3" P <100> .01 .05 Ingot
    As-grown.
BC17967 2600 3" P <111> .014 .02 Ingot
    Ground & Flatted per U.S. Stds.
WC27806 325 3" P <100> 1 10 356 406 Prime
    w/2 Semi-Std Flats
7244-1272 2300 3" P <111> <10 Ingot
    Ground, Flat & Mounted
BP02-13285 383 3" P <100> 1 10 40010 Etched
    Edge-rounded Wafer w/2 Semi-Std. Flats
BP03-12751 475 3" P <100> 1 100 575 625 Test
    SSP w/2 Semi-Std. Flats
CP02-11208 50 3" P <100> .001 .005 356 406 Prime
    w/2 Semi-Std. Flats
CP17-10041 10200 3" P <100> 1 10 Ingot
    Ground w/0 Flats or 2 Flats per Semi-Stds.
BC39650 50 3" N/As .001 .005 355 405 Prime
    SSP w/2 Semi-Std. Flats
BN10-16243 75 3" N/Ph <100> 10 30 275 325 DSP
    Prime w/2 Semi-Std. Flats
7244-2718-923 15900 3" N/Sb <111> .005 .05 Ingot
    As-grown Ground & Flatted
CP03-10685-NV 550 3" P/Bo <100> 1 100 575 625 Prime
    w/2 Semi-Std. Flats
CP15-10503 306 3" Intrinsic <100> >10,000 675 725 FZ
    >10,000 ohm-cm 675-725µm Thick Prime DSP w/Primary Flat Only, TTV <1µm & Backside LM
 

4" Wafer Listing

Top of Page Quote Cart Print 4" Listing
Add   Qty on       Resistivity Thickness  
Cart Item ID Hand Diameter Type Orientation Min. Max. Min. Max. Grade
7329 400 4" N <100> 1 100 500 550 DSP
    Prime w/Primary Flat Only
HC44001 13 4" N <111> 5 40 635 686 Ge
    As-cut Wafer
HC44002 15 4" N <111> 5 40 762 813 Ge
    As-cut Wafer
HC44003 46 4" N <111> 5 40 889 940 Ge
    As-cut Wafer
HC44004 12 4" N <Any> 5 40 1016 1067 Ge
    As-cut Coin-rolled Wafer
STK8414 675 4" N <100> 1 10 500 550 Prime
    w/2 Semi-Std. Flats
4N0-10854 4 4" N >5000 173 187 FZ
    Lapped, Etched & Edgerounded, w/Semi-Std. Primary Flat, TTV <6µm, Bow & Warp <20µm
STK9671-1 550 4" N <100> 1 40 475 575 Test
    SSP w/Primary Flat only
7244-4682-126A 4000 4" N <111> 1 9 Ingot
    As-grown Phosphorus doped
CN02-16027 25 4" N <100> 1 30 700 750 Prime
    SSP w/Primary Flat Only, TTV </=3µm
DN01-11604 375 4" N <100> 1 20 390 410 DSP
    w/2 Semi-Std Flats
DN03-10624 100 4" N <100> .001 .005 500 550 Prime
    w/2 Semi-Std. Flats
STK8414-OX 100 4" N <100> 1 10 500 550 Prime
    w/2 Semi-Std. Flats & 5000 A°±5% Wet Thermal Oxide
7358 225 4" P <100> 10 20 500 550 Prime
    w/2 Semi-Std. Flats
7375 475 4" P <100> 1 25 475 575 Test
    w/2 Semi-Std Flats
7871 175 4" P <100> 1 10 500 550 DSP
    w/Primary Flat Only, TTV <5µm, Bow <30µm
7358-AS 25 4" P <100> 10 20 500 550 Prime
    w/2 Semi-Std. Flats & 3µm±5% Wet Thermal Oxide
BC77213 150 4" P <100> .01 .02 500 550 Prime
    w/2 Flats
BC79114 175 4" P <100> 1 10 500 550 DSP
    w/2 Semi-Std. Flats
GC29152 950 4" P <100> 1 100 575 625 Prime
    w/2 Semi-Std. Flats TTV <10µm Particles <10@.3µm.
GC38892 14087 4" P <100> 1.3 3.7 Ingot
    Ground 1Flat per U.S. Semi-Stds.
HC49138 4400 4" P <111> .0015 .0035 Ingot
    Ground, flatted & mounted
HS39626 725 4" P <100> .001 .005 500 550 Prime
    w/Semi-Std Flats
DP07-095 222 4" P .024 .045 310 330 Prime
    ER & Lapped w/Primary Flat Only
SOI11000 7 4" P <100> 1 10 280 320 SOI
    CZ Handle DSP w/o oxide, Box: 1.4-2.1µm Thermal, Device 1-10 ohm-cm 35-40µm, TTV <10µm
GC38892-2 7140 4" P <100> 1.3 4.1 Ingot
    Ground 2 Flats per U.S. Semi-Stds.
STK8414-2 875 4" P <100> 1 10 500 550 Prime
    w/2 Semi-Std. Flats
HS39626-OX 43 4" P <100> .001 .005 500 550 Prime
    w/Semi-Std Flats & 2850 A°±5% Dry Chlorinated Thermal Oxide and Forming Gas Anneal
4A01-11732 346 4" x
    4" x 4" x 0.70mm Glass Borosilicate Wafer No Bevels, Surface Quality 80/50. (Schott D-263)
HC22001 23 4" N+ <Any> .0015 .003 Any Epi
    Layer N w/Any Resistivity & Thickness
7244-6014-859 7500 4" N+ <100> Any Ingot
    As-grown, Arsenic doped, Ground & Flatted
4A02-14234 10 4" Quartz
    4" Quartz 0.5mm±0.025mm Thick Polished Both Sides 60/40 with Bevel Edge & Flat
CN02-16073 142 4" Intrinsic <100> >10,000 675 725 FZ
    >10,000 ohm-cm 675-725µm Thick DSP Prime w/Primary Flat Only, TTV <1µm & Backside LM.
 

5" Wafer Listing

Top of Page Quote Cart Print 5" Listing
Add   Qty on       Resistivity Thickness  
Cart Item ID Hand Diameter Type Orientation Min. Max. Min. Max. Grade
EN03-SOI9554 17 5" N 3 10 620 630 SOI
    FZ Handle SSP Box 4500±250 A° Thermal Oxide, Device 3-5 ohm-cm, 19-21µm Thick w/2 Flats
EN03-10346 25 5" N 2.5 5.5 615 635 Prime
    w/ Primary Flat Only TTV<2µm, B & W<40
6416M 4009 5" P <100> .087 .092 Ingot
    Ground, Flatted w/2 Flats, V-notch on Primary Flat
7285-2 24 5" P .01 .02 600 650 Test
    w/Primary Flat & Etched backs, unsealed
7244-6691-2B 4100 5" P <100> <.007 Ingot
    Ground w/2 Flats
7244-6013-427 2535 5" N+ <111> <=.007 Ingot
    Ground, Flatted & Mounted, Arsenic doped
7244-6013-633 20524 5" N+ <111> .001 .01 Ingot
    As-grown Arsenic doped with 3 Flats
 

6" Wafer Listing

Top of Page Quote Cart Print 6" Listing
Add   Qty on       Resistivity Thickness  
Cart Item ID Hand Diameter Type Orientation Min. Max. Min. Max. Grade
FA01-9900 4 6" x.75mm Pyrex
    Transparent wafers with Edge Seam, Round No Flat
WC109484 1500 6" N <110> 1 10 Ingot
    Ground w/ U.S. Primary Flat Only
GC38892-5 161197 6" N <100> .025 .07396 Ingot
    Ground & 1 Flat per U.S. Semi-Stds., Antimony doped
FN06-10733 275 6" N <100> 4 7 600 700 Prime
    w/Primary Flat Only & LM
FN06-11446 25 6" N <100> >1000 1143 1168.4 FZ
    DSP w/Primary Flat Only w/3000A° ±5% Thermal Oxide, 1500A° ±5% LPCVD SiN
BC2234 50 6" P <100> 1 100 600 700 Prime
    w/Primary Flat Only, LM Optional & 750 A°±10% Thermal Oxide
BC38330 250 6" P <100> Any >=550 Reclaim
   
GC19060 22 6" P <100> 15 25 650 700 Prime
    w/Primary Flat Only
GC49266 25 6" P <100> .005 .08 1175 1225 Prime
    DSP w/V-Notch per U.S.Semi-Stds. & TTV <3µm.
HS18730 23 6" P <100> 20 30 600 655
    6" P <100> 20-30 ohm-cm 600-655µm Thick SSP w/Primary Flat Only
HS18854 1000 6" P <100> 1 30 650 700 Prime
    w/Std. Notch, TTV <5µm
HS18909 2625 6" P <100> 1 30 600 700 Prime
    w/Std. Notch
HS19222 7 6" P <100>off 1 30 700 750 Lapped
    w/Primary Flat Only
HS37809 25 6" P <100> 1 100 600 700
    6" P <100> 1-100 ohm-cm 600-700µm Thick SSP with 10,000 A°± 5% Thermal Oxide
WC78987 325 6" P <100> 1 50 650 700 Prime
    w/ Primary Flat Only
WC99755 516 6" P <100> >1 >650 Etched
    Backs
FP02-61160 150 6" P <100> .001 .005 650 700 Prime
    SSP w/Primary Flat Only
HP01-11598 8 6" P <100> 1 50 650 700 Prime
    w/ Primary Flat only & LM on Frontside at Flat.
3162085 6000 6" Any <Any> Any Ingot
    As-grown
STK9281 4 6" Any <Any> 0 100 Any Etched
    Coinrolled with Primary Flat Only.
 

8" Wafer Listing

Top of Page Quote Cart Print 8" Listing
Add   Qty on       Resistivity Thickness  
Cart Item ID Hand Diameter Type Orientation Min. Max. Min. Max. Grade
HS49355 250 8" N <100> >10 700 750 DSP
    Prime w/Std. Notch
GN16-12341 125 8" N <100> >5000 700 750 FZ
    Prime SSP with Std. Notch
IN08-11685 525 8" N <100> 1 30 700 750 Prime
    SSP w/Std. Notch & 3,000 A° ± 10% Thermal Oxide
IN08-11860 109 8" N <100> 1 30 700 750 Prime
    SSP w/Std. Notch
9911 225 8" P <100> 9 18 700 750 DSP
    w/Std. Notch & Backside Laser Mark
7574-2 39 8" P <100> .01 .03 675 775
    8" P <100> .01-.03 ohm-cm 675-775µm Thick SSP w/Std. Notch & Poly Oxide Backseal.
GC19195 1325 8" P <100> 1 100 700 750
    8" P <100> 1-100 ohm-cm 700-750µm Thick SSP with Std. Notch
HS18288 340 8" P <100> 0 50 585 775 Test
    w/Notch & 10,000 A° ±5% Thermal Oxide
WC98987 278 8" P <100> 1 50 700 750 Prime
    SSP w/Std. Notch & LM
3012007A 50 8" P <100> 10 25 700 750 SOI
    Wafer Box: 1900-4100 A°, SOI Layer 5-25 ohm-cm 2.6-3.2µm
BC118365 100 8" P <100> 1 100 700 750
    8" P <100> 1-100 ohm-cm, 700-750µm Thick SSP w/Std. Notch & LaserMark.
JK-82019 25 8" P <100> 4 6 700 750
    8" P <100> 4-6 ohm-cm 700-750µm Thick SSP w/Std. Notch & LaserMark
JK-82058 25 8" P <100> >5000 700 750 FZ
    SSP Prime w/Std. Notch
STK950-2 597 8" P <100> 1 100 675 775 Test
    w/Std. Notch
WC119234 250 8" P <100> Any 585 750 Reclaim
    w/Std. Notch & LPD's <30 @ .3µm
7574-2-OX 500 8" P <100> .01 .05 675 775
    8" P <100> .01-.05 ohm-cm 675-775µm Thick SSP w/Std. Notch & 3,000 A°±5% Thermal Oxide
OP00-9833 199 8" P <100> 1 100 700 750 Test
    w/Std. Notch
STK9500-2 25 8" P <100> 1 300 700 750
    8" P <100> 1-300 ohm-cm 700-750µm Thick SSP w/Std. Notch & LM.
HP01-T200SSP 550 8" P <100> 0 100 700 750 Test
    w/Std. Notch and backseal
GP08-13081 331 8" P <100> 8 25 700 750 Prime
    SSP with Std. Notch, TTV <5µm
GP08-13489 25 8" P <100> 1 100 675 775 DSP
    with Std. Notch, LaserMark
GP11-13193 25 8" P 4.5 6.5 700 750 Prime
    with Notch & Poly Backseal
HP01-T200R 2061 8" P <100> 0 100 >700 Etched
    Edge-rounded Coinroll w/Std. Notch
WC10103~P1 335 8" P <100> 1 30 700 750 Prime
    SSP w/Std. Notch & LM
JK-11811 15 8" Any <100> 0 300 675 775
    8" Any Type <100> 0-300 ohm-cm 675-775µm Thick SSP with Std. Notch only.
JK-11817 1500 8" Any <100> 0 300 675 775
    8" Any Type <100> 0-300 ohm-cm 675-775µm Thick SSP with Std. Notch only & 3,000A° ±5% Thermal Oxide.
EG9911 175 8" SOI SOI
    Soitec Unibond Wafer Si Thickness 1500nm SiO2 1000nm
GA06-13634 400 8" N/As <100> <.005 675 775
    8" N/As <100> <.005 ohm-cm 675-775µm Thick SSP with 3,000 A°±5% Thermal Oxide
MN01-10673 550 8" N/Ph 1 20 700 750 Prime
    SSP w/ Notch & Semi M12 Frontside LM
GP26-12991 25 8" P/Bo <100> >1000 710 740 Prime
    SSP MCZ w/Semi-std Notch and Low Oxygen (<12ppma) & Low Carbon. FS by SEH.
GN18-12648 25 8" N/Red <100> <.00 <.0013 700 750 Prime
    with Std. Notch, TTV <5µm, LTO 4500±500 A°
 

12" Wafer Listing

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Add   Qty on       Resistivity Thickness  
Cart Item ID Hand Diameter Type Orientation Min. Max. Min. Max. Grade
HP01-T300SSP 37 12" P <100> 1 40 750 850 Test
    w/Std. Notch
NP01-T300S 92 12" P <100> 1 100 750 800 Mechanical
    DSP with Notch
 

Ingot Wafer Listing

Top of Page Quote Cart Print Ingot Listing
Add   Qty on       Resistivity Thickness  
Cart Item ID Hand Diameter Type Orientation Min. Max. Min. Max. Grade
HS4962210 700 2.5" N <100> .14 .25 Ingot
    Ground
7244-69 1400 3" P <100> .01 .05 Ingot
    As-grown.
BC17967 2600 3" P <111> .014 .02 Ingot
    Ground & Flatted per U.S. Stds.
7244-1272 2300 3" P <111> <10 Ingot
    Ground, Flat & Mounted
CP17-10041 10200 3" P <100> 1 10 Ingot
    Ground w/0 Flats or 2 Flats per Semi-Stds.
7244-2718-923 15900 3" N/Sb <111> .005 .05 Ingot
    As-grown Ground & Flatted
7244-4682-126A 4000 4" N <111> 1 9 Ingot
    As-grown Phosphorus doped
GC38892 14087 4" P <100> 1.3 3.7 Ingot
    Ground 1Flat per U.S. Semi-Stds.
HC49138 4400 4" P <111> .0015 .0035 Ingot
    Ground, flatted & mounted
GC38892-2 7140 4" P <100> 1.3 4.1 Ingot
    Ground 2 Flats per U.S. Semi-Stds.
7244-6014-859 7500 4" N+ <100> Any Ingot
    As-grown, Arsenic doped, Ground & Flatted
6416M 4009 5" P <100> .087 .092 Ingot
    Ground, Flatted w/2 Flats, V-notch on Primary Flat
7244-6691-2B 4100 5" P <100> <.007 Ingot
    Ground w/2 Flats
7244-6013-427 2535 5" N+ <111> <=.007 Ingot
    Ground, Flatted & Mounted, Arsenic doped
7244-6013-633 20524 5" N+ <111> .001 .01 Ingot
    As-grown Arsenic doped with 3 Flats
WC109484 1500 6" N <110> 1 10 Ingot
    Ground w/ U.S. Primary Flat Only
GC38892-5 161197 6" N <100> .025 .07396 Ingot
    Ground & 1 Flat per U.S. Semi-Stds., Antimony doped
3162085 6000 6" Any <Any> Any Ingot
    As-grown
 

Float Zone Wafer Listing

Top of Page Quote Cart Print Float Zone Listing
Add   Qty on       Resistivity Thickness  
Cart Item ID Hand Diameter Type Orientation Min. Max. Min. Max. Grade
8445 125 3" N <111> 6 12 245 325 FZ
    Test
CN01-10274 350 3" N >3000 355 405 FZ
    Prime w/Primary Flat Only & LM
CP15-10503 306 3" Intrinsic <100> >10,000 675 725 FZ
    >10,000 ohm-cm 675-725µm Thick Prime DSP w/Primary Flat Only, TTV <1µm & Backside LM
4N0-10854 4 4" N >5000 173 187 FZ
    Lapped, Etched & Edgerounded, w/Semi-Std. Primary Flat, TTV <6µm, Bow & Warp <20µm
CN02-16073 142 4" Intrinsic <100> >10,000 675 725 FZ
    >10,000 ohm-cm 675-725µm Thick DSP Prime w/Primary Flat Only, TTV <1µm & Backside LM.
FN06-11446 25 6" N <100> >1000 1143 1168.4 FZ
    DSP w/Primary Flat Only w/3000A° ±5% Thermal Oxide, 1500A° ±5% LPCVD SiN
GN16-12341 125 8" N <100> >5000 700 750 FZ
    Prime SSP with Std. Notch
JK-82058 25 8" P <100> >5000 700 750 FZ
    SSP Prime w/Std. Notch
 

Epi Wafer Listing

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Add   Qty on       Resistivity Thickness  
Cart Item ID Hand Diameter Type Orientation Min. Max. Min. Max. Grade
SAP-16658 50 2" Sapphire 43020 Epi
    Ready Wafer w/Primary Flat Only, TTV <10µm, Bow & Warp <=10µm, Ra =<0.3nm
BC88996 172 3" N >.01 356 406 Epi
    layer= 7.5-10 ohm-cm 20-25µm
HC22001 23 4" N+ <Any> .0015 .003 Any Epi
    Layer N w/Any Resistivity & Thickness
 
 

SOI (Silicon-On-Insulator) Wafer Listing

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SOI material is used widely in applications such as telecommunication products and optical devices, dielectrically isolated integrated circuits, solid state relays and micro-machined components for sensors and actuators.

NOVA offers an innovative and powerful through-wafer interconnect technology which can allow device designers in both standard IC and MEMS device industries overcome packaging problems associated with their designs. NOVA offers a fully customized engineered substrate solution to minimize your fabrication headaches.

Typical Diameters range from 4" to 300mm. Please complete our Request a Quote form with your specifications so NOVA can quote your needs!
 
 

Epitaxial Wafer Listing

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Epitaxial silicon wafers are made through the precipitation of a monocrystalline silicon coat. The substratum consists of a polished silicon wafer.

Epitaxial wafers are used for discrete applications and, because of their extraordinary quality as semiconductors, for the manufacturing of the most progressive and highly integrated semiconductor construction elements (ICs).

Typical Diameters range from 3" to 300mm. Please complete our Request a Quote form with your specifications so NOVA can quote your needs!
 
 

Solar Wafer Listing

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NOVA creates significant competitive advantages, in terms of cost and quality, which are passed through the value chain of the entire silicon-based solar cell manufacturing market. The resulting single crystal wafers are manufactured and sold to meet the growing demands of the photovoltaic industry's major solar cell and module manufacturers, helping to further satisfy rapidly expanding end-user demand currently growing by 35 percent per year. Because NOVA's sources are designed for very high volume materials handling, as opposed to traditional precision semiconductor manufacturing that has been used to service the photovoltaic industry's silicon wafer needs in the past, NOVA can allow far better utilization of raw silicon feedstock at significantly lower cost within the supply chain.

Typical Diameters range from 3" to 125mm psuedo square to 300mm. Please contact NOVA's specialist or complete our Request a Quote form with your specifications so NOVA can quote your needs!