1"-2" Wafer Listing
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HS18810
118
1"
N
<100>
1
10
660
712
SSP
Notch
W/ 3,000 Å ±5% THERMAL OXIDE.
WC28242
50
2"
N
<100>
1
10
254
305
TEST
8289
1200
2"
P
<100>
1
10
254
305
TEST
SSP
HS4962210-1
26
2.5"
N
<100>
0.14
0.23
496
521
LAPPED & ER COINROLLED
HS4962210
1540
2.5"
N
<100>
0.14
0.23
INGOT
~2.5" N/As GROUND INGOT
BC5197
1800
2.5"
P
<111>
0.025
0.028
INGOT
GROUND & FLATTED INGOT
3" Wafer Listing
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CA02-10016 (GaAs)
3
3"
N/Te
<100>
2.3E18
480
520
SSP*
1
N(Te) cc: 2.3x10E 18, MOBILITY: 2370, EPD: 4x10E4, 500µm ±20µm SSP GaAs wafers w/ 1 FLAT & LOW TTV, <3µm.
WC68229-1
99
3"
N
<100>
< .005
356
406
SSP
HS18229
825
3"
N/As
<100>
< .005
355
406
SSP
WC37620-NV
700
3"
N/Ph
<100>
1
10
356
406
PRIME
1
SSP
7395
3000
3"
N/Ph
<100>
1
10
356
406
PRIME
1
W/ PRIMARY FLAT ONLY & 3,000 Ang.± 5% THERMAL OXIDE
WC37620
50
3"
N/Ph
<100>
1
10
356
406
PRIME
1
SSP W/ PRIMARY FLAT ONLY
NPO7288
50
3"
N
<100>
5
10
330
432
TEST
WC37573
25
3"
N
<100>
5
10
356
406
PRIME
2
W/ 2 SEMI-STD FLATS
7244-1598
1200
3"
N/As
<100>
ANY
ANY
INGOT
1
MOUNTED ARSENIC Si INGOT
BC4030
73
3"
N
<111>
< .013
550
625
ASCUT
BC971942~P1
325
3"
N/Sb
<111>
0.005
0.02
305
457
2
SSP
7244-2718-923
30550
3"
N/Sb
<111>
0.005
0.05
INGOT
ANTIMONY(Sb), AS-GROWN,GROUND & FLAT, GROUND INGOT
BC39650
25
3"
N/Sb
<111>
0.008
0.016
356
406
PRIME
SSP WITH TTV <2µm
7244-2718-935B
14700
3"
N/Sb
<111>
0.01
0.05
INGOT
ANTIMONY DOPED, AS-GROWN &/OR GROUND&FLATTED INGOT
BC3032
73
3"
N
<111>
.05
0.10
300
406
ASCUT
COINROLL
7244-1602
4500
3"
N/ARS
<111>
1.17
2.11
INGOT
ARSENIC DOPED, AS-GROWN INGOT
8445
275
3"
N
<111>
6
12
280
300
PRIME
<111>OFF 3°±1° TOWARD THE NEXT <1-1-0>PLANE; SSP FZ Si WAFERS
BC88996
173
3"
N/N+
<111>
> .01
356
406
EPI
Sb DOPED, (111) OFF 3-4° WITH EPI LAYER= N (PHOS) 7.5-10 OHM-CM, 20-25µm THICK
HC40561
28
3"
N/Ph
ANY
ANY
ANY
ANY
ANY
ASCUT
PHOS DOPED, AS-CUT EDGEROUND Ge WAFERS
7244-6012-91A
816
3"
P
<100>
< .005
429
436
ASCUT
2
W/ 2 SEMI-STD FLATS
7244-69
3800
3"
P
<100>
0.01
0.05
INGOT
2
AS-GROWN&/OR GRD & 2 FLAT INGOT
CP17-10041
16300
3"
P
<100>
1
10
INGOT
GROUND INGOT, WITH 0 FLATS OR 2 FLATS PER SEMI-STDS
WC27806
25
3"
P
<100>
1
20
356
406
TEST
SSP
BC17967
7200
3"
P
<111>
.014
.02
INGOT
GROUND & FLAT Si INGOT PER US STDS.
7244-1272
2300
3"
P
<111>
ANY
INGOT
GROUND, FLAT & MOUNTED INGOT
4" Wafer Listing
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HC44002 (Ge)
50
4"
N
ANY
5
40
762
813
ASCUT
Ge WAFERS
DN03-10624
50
4"
N
<100>
< .005
500
550
PRIME
2
SSP W/ 2 SS FLATS
STK8414
368
4"
N/Ph
<100>
1
10
500
550
PRIME
1 FLAT
W/ US PRIMARY FLAT ONLY (SOME W/ 2 FLATS)
4N0-10848
24
4"
N/Ph
<100>±1°
>5000
150
160
FZ
1
DSP FZ W/ SEMI-STD PRIMARY FLAT ONLY; LIFETIME>2 MILLISECONDS
4N0-10854
216
4"
N/Ph
<100>±1°
>5000
173
187
FZ
1
LAPPED, ETCHED & ER W/ SEMI-STD PRIMARY FLAT ONLY
7244-6014-859
9400
4"
N/As
<100>
ANY
ANY
INGOT
ARSENIC DOPED; GROUND OR G&F INGOTS
BC1102~P1
2000
4"
N
<111>
.008
.018
INGOT
BY MEMC
7244-4682-126A
4000
4"
N/Ph
<111>
< .02
INGOT
AS-GROWN
DN1-10832
75
4"
N
<111>
1500
2500
382
418
FZ
SSP W/ SEMI-STD FLATS (MANUFACTURED BY WACKER)
HC44004 (Ge)
23
4"
N
ANY
5
40
1016
1067
ASCUT
Ge WAFERS *
HC44003 (Ge)
50
4"
N
ANY
5
40
762
813
ASCUT
Ge WAFERS*
HC44001 (Ge)
24
4"
N
ANY
5
50
635
686
ASCUT
Ge WAFERS*
HC22001
23
4"
N/N+
ANY
.0015
.003
ANY
ANY
EPI
WITH EPI LAYERS = ANY RESISTIVITY & THICKNESS
DN10-40155
23
4"
N/N+
<100>
.007-.02/2.53=2.97 OHM-CM; 375-425/15.437-17.062µm THICK SSP EPI WAFERS W/ OXIDE BACKS
HS39626
250
4"
P
<100>
.001
.005
500
550
PRIME
SSP W/ STD FLATS
DP03-11187
50
4"
P
<100>
.2
.4
500
550
PRIME
2
SSP W/ 2 SEMI-STD FLATS
STK8414-2
4
4"
P
<100>
1
10
500
550
PRIME
1 FLAT
W/ U.S. PRIMARY FLAT ONLY & LM
STK9671
86
4"
P
<100>
1
10
500
550
PRIME
1 FLAT
SSP W/ SEMI-STD FLATS; LPD'S <20@.3µm
DN03-10041
15300
4"
P
<100>
1
10
INGOT
0 FLAT
GROUND INGOT, WITH 0 FLATS
SOI11000
29
4"
P
<100>
1
10
SOI
HANDLE: 300±20µm THICK DSP W/OUT OXIDE; BOX: 1.5-2µm THERMAL OXIDE; DEVICE: 35-40µm
BC79114
650
4"
P
<100>
1
50
475
550
DSP
W/ SEMI-STD FLATS
GC38892
112876
4"
P
<100>
1.3
3.7
INGOT
1 FLAT
GROUND W/ 1FLAT ONLY INGOT PER U.S. SEMI-STD.
GC38892-2
79214
4"
P
<100>
1.3
4.1
INGOT
GROUND WITH 2 U.S. FLATS PER U.S. SEMI-STDS
GC39152
33
4"
P
<100>
1.3
3.7
500
550
PRIME
1 FLAT
W/ U.S. PRIMARY FLAT ONLY & PARTICLES<10@.3µm
GC29152-1
535
4"
P
<100>
1.3
4.55
610
630
ASCUT
2
ASCUT, ER Si WAFERS W/ 2 SEMI-STD. FLATS
BC27819
268
4"
P
<100>
20
40
500
550
PRIME
2
W/ 2 FLATS PER SEMI-STD
7352A
1814
4"
P
<100>
3.75
3.85
INGOT
NON-STD
GROUND W/2 FLATS & V-NOTCH ON PRIMARY FLAT
7352B
2602
4"
P
<100>
3.85
3.89
INGOT
NON-STD.
GROUND W/2 FLATS & V-NOTCH ON THE PRIMARY FLAT!
7358
408
4"
P
<100>
5
25
500
550
PRIME
2
W/ 2 SEMI-STD FLATS
7375
2050
4"
P
<100>
1
25
475
575
TEST
2
W/ 2 FLATS; LPD'S <30@ .5
HC49138
8100
4"
P
<111>
.0015
.0035
INGOT
GROUND & FLAT INGOT PER U.S. SEMI-STDS
7425
50
4"
P+
<111>
0.008
0.02
500
540
PRIME
OFF 2.5-3.5°, WITH OXIDE BACKSEAL & 1 SEMI.STD. FLAT, FS
7384~P3
25
4"
P
<111>
1
10
500
550
TEST
1
OREN. OFF 4° W/ 1 SEMI-STD FLAT
5" Wafer Listing
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6387M
2987
5"
N/Sb
<100>
.044
.047
INGOT
Sb, GROUND & FLAT INGOT W/2 FLATS & V-NOTCH ON PRIMARY FLAT
7479-1
409
5"
N
<100>
1
10
380
405
ETCH
ETCH, EDGE-ROUNDED Si WAFERS COIN-ROLLED
EN03-9778
28
5"
N/Ph
<100>
10
50
600
650
PRIME
NOTCH
W/ PRIMARY NOTCH ONLY PER SEMI-STDS
EN03-10346
50
5"
N/Ph
<100>±1°
2.5
5.5
620
625
PRIME
1
SSP W/ PRIMARY FLAT ONLY (ON <110>±1°, 42..
EN03-10345
25
5"
N/Ph
<100>±1°
3
10
620
625
PRIME CZ
1
SSP W/ PRIMARY FLAT ONLY (ON <110>±1°, 42..
7244-6013-427
6337
5"
N/As
<111>
< .007
INGOT
GROUND, FLAT & MOUNTED INGOT
7244-6013-633
20524
5"
N/As
<111>
.001
.01
INGOT
3 FLATS
ARSENIC DOPED, AS-GROWN INGOT W/3 FLATS
WC67391F
40
5"
N/Ph
<111>
> 100
ANY
ANY
DSP
PHOS DOPED, FZ, US, Si WAFERS
EN03-SOI9554
17
5"
N
<100>±1°
3
10
620
630
PRIME
HANDLE WAFER: SSP FZ Si WAFERS; BURIED OXIDE: 450nm±25nm THERMAL OXIDE
BC87412
125
5"
P
<100>
0.005
0.015
600
650
PRIME
PER SEMI-STDS 2 STD FLATS
7244-6691-2B
7720
5"
P
<100>
.005
.02
INGOT
NOTCH
AS-GROWN, G&F, GROUND & MOUNTED W/NOTCH INGOT
GC211001-4
163
5"
P
<100>
.01
.02
600
650
PRIME
1 FLAT
W/PRIMARY FLAT ONLY AND PARTICLES <20@ .5 <20 @ 0.5>
6416M
4009
5"
P
<100>
.087
.092
INGOT
NON-STD
GROUND & FLAT INGOT W/V-NOTCH ON PRIMARY FLAT
7479-3
108
5"
P
<100>
1
10
380
405
ETCH
EDGE-ROUNDED Si WAFERS COIN-ROLLED
HS28778
25
5"
P
<100>
ANY
ANY
600
650
PRIME
1 FLAT
W/ LASERMARK
73871
44
5"
P
<100>
> 100
630
730
LAPPED
NON-STD
EDGE-ROUNDED Si WAFERS W/2 FLATS, PRIMARY FLAT HAS V-NOTCH
7409-1
25
5"
P
<100>
11
50
600
650
PRIME
NOTCH
<100>on ±.5°, PRIME DSP Si WAFERS WITH NOTCH ON (110) PLANE & LM ON FRONT & TTV < 10µ MAX
WC98615
25
5"
P
<100>
20
40
600
650
PRIME
2
FS BY MEMC
7387
89
5"
P
<100>
42
52.1
725
750
ASCUT
NON-STD
W/2 FLATS, PRIMARY FLAT HAS V-NOTCH
7285-2
125
5"
P
<111>
.01
.02
600
650
PRIME
W/ ETCHED BACKS & PRIMARY FLAT ONLY
72424~P1
50
5"
P
<111>
3
5
600
640
PRIME
<111>OFF 3-5°, W/ EG BACKS & 1 FLAT
6" Wafer Listing
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FA01-9900
4
6"
ANY
ANY
ANY
ANY
750
PYREX
6" X .75mm THICK PYREX WAFERS WITH EDGES SEAMED.
3162085
10500
6"
ANY
ANY
ANY
ANY
INGOT
AS-GROWN INGOT
FN0600-700
76
6"
N/Sb
<100>
.008
.02
600
700
ETCHED
1
W/ PRIMARY FLAT
GC38892-5
206245
6"
N
<100>
.025
.074
INGOT
1 FLAT
GROUND & 1 FLAT PER U.S. SEMI-STDS.
HS29284
477
6"
N
<100>
1
100
600
700
TEST
1 FLAT
(NOTE: 100sl W/ 10,000 ű5% THERMAL OXIDE)
FN03-11006
96
6"
N
<100>
1
30
>675
PRIME
NOTCH
LAPPED, ER W/ SEMI-STD V-NOTCH
FN02-61465
25
6"
N
<100>
10
20
490
526
SSP
W/ STD. FLAT
FN05-11081-2
50
6"
N/Ph
<100>
4.5
9
622.3
647.7
DSP
W/ STD. PRIMARY FLAT ONLY, TTV <3µm, B/W <20µm
FN05-11081
75
6"
N/Ph
<100>
4.5
9
672.3
697.7
DSP
W/ STD. PRIMARY FLAT ONLY, TTV <3µm, B/W <20µm
FN06-10733
26
6"
N
<100>
5
75
610
690
SSP
1
W/ PRIMARY FLAT ONLY
WC109484
1500
6"
N/Ph
<110>
1
10
INGOT
1 FLAT
GROUND W/ U.S. PRIMARY FLAT ONLY, PER U.S. SEMI-STD. INGOT
GC49266
950
6"
P
<100>
.005
.08
1175
1225
DSP
NOTCH
PRIME DSP Si WAFERS W/V-NOTCH, TTV <3µm & ><10 PARTICLES @ 0.5µm><3µm
WC99755
50
6"
P
<100>
> 1
710
740
SSP
1 FLAT
HS19045
175
6"
P
<100>
1
30
600
700
SSP
V-NOTCH
PRIMARY V-NOTCH W/ 3K THERMAL OXIDE
HS18004
18
6"
P
<100>
1
50
600
650
PRIME
1 FLAT
W/ .35µm STEPPED MASKING, RESIST STRIP, DRY ETCH UP TO 1µ TRENCH, 1500A TiN ON TOP
7448
48
6"
P
<100>
>1
645
705
TEST
W/ 2K Å THERMAL OXIDE
HS38780
48
6"
P
<100>
1
50
650
700
PRIME
1 FLAT
SSP W/ PRIMARY FLAT ONLY & 10,000 ANG. THERMAL OXIDE ±5%
BC38330
2134
6"
P
<100>
ANY
ANY
>550
RECLAIM
SSP
7296~P1
25
6"
P
<100>
1000
2000
650
700
DSP
FZ
AV38078
7
6"
P
<100>
> 3500
765
1260
EDGE-ROUNDED
NOTCH
HS89121
1414
6"
ANY
<100>
ANY
ANY
1150
1350
PRIME
NOTCH
SSP W/ STD. NOTCH, TTV </=3µm
WC78987
49
6"
P
<100>
1
50
650
700
SSP
1 FLAT
W/ PRIMARY FLAT ONLY
FP05-10481
1222
6"
P
<100>
ANY
ANY
600
700
TEST
1
SSP W/ 1 FLAT ONLY
9834
1443
6"
P
<110>
10
20
610
640
PRIME
1
LASERMARK
FP04-10107
897
6"
P
<100>
0
100
600
700
NOTCH
SSP W/ NOTCH & 3,000ű5% THERMAL OXIDE
FP16-18828
1185
6"
ANY
<100>
ANY
ANY
600
700
NOTCH
SSP W/ NOTCH ONLY & TTV </= 15µm
7467
94
6"
P
<100>
5
30
625
725
TEST
1
W/ 1 SEMI STD PRIMARY FLAT; TTV <10
HS18854
838
6"
P
<100>
1
30
650
700
PRIME
NOTCH
TTV </= 3µm
200mm/300mm Wafer Listing
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HS18590
175
200mm
ANY
ANY
ANY
ANY
760
890
SSP
JK-81940
48
200mm
N/N+
<100>
EPI
.0015-.0035/.877-.979 OHM-CM, 710-740/6.4-7.56µm THICK SSP EPI W/ POLY, OX BKS
JK-81699
50
200mm
N/P+
<100>
EPI
.01-.02/8-10 OHM-CM, 710-740/13-15µm THICK SSP EPI W/ OX BKS &LM
3012007A
27
200mm
ANY
ANY
ANY
ANY
ANY
ANY
RECLAIMABLES
OP00-9809
50
200mm
P
<100>
<.02
675
775
TEST
NOTCH
SSP W/ V-NOTCH & ETCHED BACKSIDE
WC10103~P1
15
200mm
P
<100>
.5
100
705
740
PRIME
7574-2
200
200mm
P
<100>
.700
1.1
710
740
PRIME
NOTCH
SSP W/ SEMI-STD NOTCH & POLYBACKS
HP01-T200SSP
51
200mm
P
<100>
0
100
650
775
SSP
NOTCH
W/ STD. NOTCH & LPD’S <100@.3
7574-1
2775
200mm
P
<100>
1
100
690
760
TEST
W/ NOTCH & PLOY BACKS .8µm±10%
HP01-T200R
5455
200mm
P
<100>
1
100
700
750
RECLAIMABLE
SSP
OP00-9833
223
200mm
P
<100>
1
100
695
750
TEST
NOTCH
WC98987
63
200mm
P
<100>
10
25
700
750
SSP
NOTCH
W/ STD. NOTCH & OPTIONAL LM
JK-82058
75
200mm
P
<100>
1500
2000
700
750
SSP
NOTCH
W/ ECHED BACKS & STD. NOTCH FZ
JK-82019
25
200mm
P
<100>
2
4
710
740
PRIME
NOTCH
SSP W/ ETCH BACKS & LM OPPOSITE OF NOTCH
9911
250
200mm
P
<100>
9
18
712
762
DSP
NOTCH
W/ LASERMARK
GC19195
200
200mm
P or N
<100>
>1
650
750
VIRGIN TEST
NOTCH
SSP
OP03-11146
75
200mm
P
<100>
>25
>650
TEST
NOTCH
SSP W/ PART <30@ .3µm
JK-81088
600
200mm
P/P+
<100>
EPI
.005-.01/9.9-12.6815 OHM-CM; 705-745/3.8-4.2µm THICK SSP PRIME EPI W/ POLY OX BKS, LM
JK-81985
100
200mm
P/P+
<100>
EPI
.005-.01-9.9-12.6815 OHM-CM; 705-745/2.85-3.15µm THICK, SSP EPI W/ POLY OX BKS & LM
PP01-9818
125
300mm
P
<100>±1°
1
100
750
800
DSP
Litho. Grade w/ std. notch, LM, Warp <50µm, SFQR><.18µm (95% PUA; 26x33mm), LPD><50@.16µm
NP-T300R
3
300mm
P
<100>
1
100
750
800
DSP
W/ FILMS OR PATTERNS
NP01-T300S
25
300mm
P
<100>
1
100
750
800
RECLAIMABLE
DSP
STK9754
25
300mm
P
<100>
1
100
750
800
DSP
Prm Grade W/ Site Flatness SFQR=0.15µm(Site Size 26x33 mm w/95% Global>
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