1"-2" Wafer Listing
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SAP-14781
5
1"
Sapphire
405
455
DSP
wafer with No Flat
A02-17534
29
1"
Germanium
<111> 5-40
5
40
275
325
DSP
Wafer with 1 Std. Flat
8376
150
2"
N
<100>
1
10
254
305
Prime
SSP w/Primary Flat Only
8289
1250
2"
P
<100>
1
10
254
306
Prime
SSP w/ Primary Flat only.
CA02-10016
38
2"
N+
<100>
325
375
GaAs
Wafer
WC11081
225
2"
N/As
<111>±.5°
.001
.005
254
304
Prime
SSP w/Primary Flat Only
7244-232
25
2"
P/Bo
<100>
.001
.005
254
305
2" P/Bo <100> .001-.005 ohm-cm 254-305µm Thick SSP w/Primary Flat Only
SAP-14996
75
2"
Sapphire
405
455
DSP
Prime Epi Ready Wafer with Primary Flat Only
SAP-16658
150
2"
Sapphire
410
450
Epi
Ready Wafer w/Primary Flat Only, TTV <10µm, Bow & Warp <=10µm, Ra =<0.3nm
A02-17983
4
2"
Germanium
<110>±1°, LM/Barcode Centered on Backside
2" Germanium N/Sb <0001> 975-1025µm Thick SSP Wafer with Primary Flat Only <110>±1°, LM/Barcode Centered on Backside
HS4962210
700
2.5"
N
<100>
.14
.25
Ingot
Ground
3" Wafer Listing
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BC3032
39
3"
N
<111>
.05
.1
300
406
As-cut
Coin-roll
7395-LM
549
3"
N
<100>
1
10
356
406
Prime
SSP with Primary Flat Only, BS LM & 3,000 Ang. ±5% Thermal Oxide
BC88996
172
3"
N
<111>off3-4°
>.01
356
406
Epi
layer= 7.5-10 ohm-cm 20-25µm
HC40561
21
3"
N
<110>
Any
and
Ge
As-cut Edgerounded Wafer w/2 Flats
HS18229
25
3"
N
<100>
.001
.005
355
405
Prime
SSP w/2 Semi-Std. Flats
WC37192
25
3"
N
<100>
>20
381
483
Test
with Semi Flats
BC4025-LM
915
3"
N
<100>
1
100
275
325
DSP
Prime with 2/ Semi-Std. Flats & Backside LM
CN01-10274
350
3"
N
<100>±.5°
>3000
355
405
FZ
Prime SSP w/Primary Flat Only & LM
WC37192-LM
675
3"
N
<100>
>20
381
483
Test
with Semi Flats & Backside LM
WC37620-NV
250
3"
N
<100>
1
10
356
406
Prime
SSP w/Primary Flat Only
BC17967
2600
3"
P
<111>
.014
.02
Ingot
Ground & Flatted per U.S. Stds.
WC27806
875
3"
P
<100>
1
10
356
406
Prime
SSP w/2 Semi-Std Flats
7244-1272
2300
3"
P
<111>
<10
Ingot
Ground, Flat & Mounted
CP02-11208-OX
75
3"
P
<100>
.001
.005
356
406
Prime
SSP w/2 Semi-Std. Flats & 6,000 A°±5% Wet Thermal Oxide
CP01-10973
125
3"
P
<100>
.001
.005
355
405
3" P <100> .001-.005 ohm-cm 355-405µm Thick SSP with 1 Semi-Std. Flat
CP02-11208
500
3"
P
<100>
.001
.005
356
406
Prime
SSP w/2 Semi-Std. Flats
CP17-10041
10200
3"
P
<100>
1
10
Ingot
Ground w/0 Flats or 2 Flats per Semi-Stds.
BC39650
357
3"
N/As
<111>±.5°
.001
.005
355
405
Prime
SSP w/2 Semi-Std. Flats
7244-2718-923
15900
3"
N/Sb
<111>
.005
.05
Ingot
As-grown Ground & Flatted
3FS-19351
50
3"
Fused
350
400
DSP
Wafer w/Primary Flat Only, TTV <10µm, Optical Clarity: Transparent to 355nm (UV) Light
CP15-10503
225
3"
Intrinsic
<100>
>10,000
675
725
FZ
>10,000 ohm-cm 675-725µm Thick Prime DSP w/Primary Flat Only, TTV <1µm & Backside LM
4" Wafer Listing
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Print 4" Listing
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7280
200
4"
N
<111>
.001
.005
490
560
4" N <111> .001-.005 ohm-cm 490-560µm Thick SSP w/Semi Flats
7329
75
4"
N
<100>
1
100
500
550
DSP
Prime w/Primary Flat Only
BC98787
25
4"
N
<100>
.01
.02
500
550
Prime
SSP w/2 Semi-Std. Flats
HC44002
15
4"
N
<111>
5
40
762
813
Ge
As-cut Wafer
HC44003
46
4"
N
<111>
5
40
889
940
Ge
As-cut Wafer
HC44004
12
4"
N
<Any>
5
40
1016
1067
Ge
As-cut Coin-rolled Wafer
STK8414
1175
4"
N
<100>
1
10
500
550
Prime
SSP w/2 Semi-Std. Flats
7244-4682-126A
4000
4"
N
<111>
1
9
Ingot
As-grown Phosphorus doped
DN01-11604-LM
400
4"
N
<100>
1
20
390
410
DSP
w/2 Semi-Std Flats & Backside LM
DN01-11604
225
4"
N
<100>
1
20
390
410
DSP
w/2 Semi-Std Flats
DN03-10624
125
4"
N
<100>
.001
.005
500
550
Prime
SSP w/2 Semi-Std. Flats
STK9671-1-LM
243
4"
N
<100>
1
40
475
575
Test
SSP w/Primary Flat only & Backside LM
STK8414-LM
600
4"
N
<100>
1
10
500
550
Prime
SSP w/2 Semi-Std. Flats & Backside LM
STK8414-OX
75
4"
N
<100>
1
10
500
550
Prime
SSP w/2 Semi-Std. Flats & 5000 A°±5% Wet Thermal Oxide on both sides
7358
50
4"
P
<100>
10
20
500
550
Prime
SSP w/2 Semi-Std. Flats
7375
900
4"
P
<100>
1
25
475
575
Test
SSP w/2 Semi-Std Flats
7871
125
4"
P
<100>
1
10
500
550
DSP
w/Primary Flat Only, TTV <5µm, Bow <30µm
7375-OX
150
4"
P
<100>
1
25
475
575
Test
SSP w/2 Semi-Std Flats & 10,000 A°±5% Thermal Oxide
BC77213
200
4"
P
<100>
.01
.02
500
550
Prime
SSP w/2 Semi-Std. Flats
BC79114
225
4"
P
<100>
1
10
500
550
DSP
w/2 Semi-Std. Flats
GC38892
14087
4"
P
<100>
1.3
3.7
Ingot
Ground 1Flat per U.S. Semi-Stds.
HC49138
4400
4"
P
<111>
.0015
.0035
Ingot
Ground, flatted & mounted
HS39626
1625
4"
P
<100>
.001
.005
500
550
Prime
SSP w/2 Semi-Std Flats
DP07-095
222
4"
P
<111>±1°
.024
.045
310
330
Prime
ER & Lapped w/Primary Flat Only
GC38892-2
7140
4"
P
<100>
1.3
4.1
Ingot
Ground 2 Flats per U.S. Semi-Stds.
STK8414-2
1050
4"
P
<100>
1
10
500
550
Prime
SSP w/2 Semi-Std. Flats
STK8414-2LT-OX10
74
4"
P
<100>
1
10
500
550
Prime
SSP w/2 Semi-Std. Flats, TTV <5µm & 10,000 A°±5% Wet Thermal Oxide on both sides
STK8414-2-OX10
25
4"
P
<100>
1
10
500
550
Prime
SSP w/2 Semi-Std. Flats & 10,000 A°±5% Wet Thermal Oxide
STK8414-2LT-OX
75
4"
P
<100>
1
10
500
550
Prime
SSP w/2 Semi-Std. Flats, TTV <5µm & 5,000 A°±5% Wet Thermal Oxide on both sides
STK8414-2-OX1
25
4"
P
<100>
1
10
500
550
Prime
SSP w/2 Semi-Std. Flats & 1000 A°±10% Wet Thermal Oxide on both sides
BC79114-1F
175
4"
P
<100>
1
10
500
550
DSP
Prime w/Primary Flat Only
HS39626-DO
150
4"
P
<100>
.001
.005
500
550
Prime
SSP w/2 Semi-Std Flats & 2850 A°±5% Dry Thermal Oxide
HS39626-OX
174
4"
P
<100>
.001
.005
500
550
Prime
SSP w/2 Semi-Std Flats & 2850 A°±5% Dry Chlorinated Thermal Oxide and Forming Gas Anneal
HS39626-WO
225
4"
P
<100>
.001
.005
500
550
Prime
SSP w/2 Semi-Std Flats & 2850 A°±5% Wet Thermal Oxide
STK8414-2-LM
600
4"
P
<100>
1
10
500
550
Prime
SSP w/2 Semi-Std. Flats & Backside LM
STK8414-2-OX
125
4"
P
<100>
1
10
500
550
Prime
SSP w/2 Semi-Std. Flats & 5,000 A°±5% Wet Thermal Oxide on both sides
HS39626-DO9
25
4"
P
<100>
.001
.005
500
550
Prime
SSP w/2 Semi-Std Flats & 900 A°±10% Dry Thermal Oxide
HS39626-OX9
75
4"
P
<100>
.001
.005
500
550
Prime
SSP w/2 Semi-Std Flats & 900 A°±10% Dry Chlorinated Thermal Oxide and Forming Gas Anneal
HS39626-OXS
26
4"
P
<100>
.001
.005
500
550
Prime
w/2 Semi-Std Flats, 2850 A°±5% Dry Chlorinated Thermal Oxide & Forming Gas Anneal, Single Pack
STK8414-2LT
75
4"
P
<100>
1
10
500
550
Prime
SSP w/2 Semi-Std. Flats, TTV <=5µm
4A01-11732
321
4"
x
4" x 4" x 0.70mm Glass Borosilicate Wafer No Bevels, Surface Quality 80/50. (Schott D-263)
HC22001
15
4"
N+
<Any>
.0015
.003
Any
Epi
Layer N w/Any Resistivity & Thickness
7244-6014-859
7500
4"
N+
<100>
Any
Ingot
As-grown, Arsenic doped, Ground & Flatted
CA04-19174
400
4"
Any
475
575
4" Any Type, Orientation & Resistivity 475-575µm Thick SSP w/2 Semi-Std. Flats, Coin Roll
4U0-19528
125
4"
Undoped
<100>
>100
500
550
Prime
with Primary Flat only
SAP4-18765
50
4"
Sapphire
475
525
DSP
Wafer w/Primary Flat Only
4B01-18764
75
4"
Borofloat
500
550
DSP
Wafer with Primary Flat Only
4I0-11370
100
4"
Intrinsic
<100>
>10,000
500
550
FZ
>10,000 ohm-cm 500-550µm Thick Prime DSP w/Primary Flat Only
4I0-11370-OXS
10
4"
Intrinsic
<100>
>10,000
500
550
FZ
>10,000 ohm-cm 500-550µm Thick Prime DSP w/Primary Flat Only & 2850 A°±5% Dry Chlorinated Thermal Oxide and FGA, Single Pk
4I0-11370-LM
125
4"
Intrinsic
<100>
>10,000
500
550
FZ
>10,000 ohm-cm 500-550µm Thick Prime DSP w/Primary Flat Only & Backside LM
4I0-11370-OX
75
4"
Intrinsic
<100>
>10,000
500
550
FZ
>10,000 ohm-cm 500-550µm Thick Prime DSP w/Primary Flat Only & 2850 A°±5% Dry Chlorinated Thermal Oxide and FGA
4I0-11370-LM-WO
100
4"
Intrinsic
<100>
>10,000
500
550
FZ
>10,000 ohm-cm 500-550µm Thick Prime DSP w/Primary Flat Only, Backside LM & 2500A±5% Wet Thermal Oxide
4I20-20015
25
4"
Intrinsic
<100>
>20,000
500
550
FZ
>20,000 ohm-cm 500-550µm Thick SSP Prime w/Primary Flat Only
CN02-16073
525
4"
Intrinsic
<100>
>10,000
675
725
FZ
>10,000 ohm-cm 675-725µm Thick DSP Prime w/Primary Flat Only, TTV <1µm & Backside LM.
5" Wafer Listing
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WC67391F
74
5"
N
<111>
>20
215
230
FZ
>20 ohm-cm 215-230µm Thick SSP
7244-6013-427
2535
5"
N+
<111>
<=.007
Ingot
Ground, Flatted & Mounted, Arsenic doped
7244-6013-633
20524
5"
N+
<111>
.001
.01
Ingot
As-grown Arsenic doped with 3 Flats
6" Wafer Listing
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FA01-9900
4
6"
x.75mm
Pyrex
Transparent wafers with Edge Seam, Round No Flat
HS18158
225
6"
N
<100>
1
10
650
700
6" N <100> 1-10 ohm-cm 650-700µm Thick SSP w/Primary Flat Only
WC109484
1500
6"
N
<110>
1
10
Ingot
Ground w/ U.S. Primary Flat Only
GC38892-5
161197
6"
N
<100>
.025
.07396
Ingot
Ground & 1 Flat per U.S. Semi-Stds., Antimony doped
FN06-10733-OXN
50
6"
N
<100>
1
10
600
700
Prime
SSP w/Primary Flat Only, LM, 10,000 A° WTO & 4,000 A° Stoichiometric LPCVD Nitride
BC107171~XL~P1
100
6"
N
<100>
1
3
495
505
DSP
Prime w/Std. Primary Flat Only, TTV <2µm, Backside LM
FN06-10733
250
6"
N
<100>
1
20
650
700
Prime
SSP w/Primary Flat Only
7447
25
6"
P
<100>
1
100
550
600
Prime
SSP with Jeida Flat
7460
100
6"
P
<100>
1
20
650
700
DSP
w/Primary Flat Only
7467
25
6"
P
<100>
1
50
600
700
6" P <100> 1-50 ohm-cm 600-700µm Thick SSP w/Primary Flat Only & 3,000 A°±5% Thermal Oxide
BC2234
175
6"
P
<100>
1
100
600
700
Prime
SSP w/Primary Flat Only, LM Optional & 750 A°±10% Thermal Oxide
C2TC017
875
6"
P
<100>
1
100
Test
SSP w/ Primary Flat Only.
GC19060
1725
6"
P
<100>
10
30
650
700
Prime
SSP w/Primary Flat Only
HS18909
800
6"
P
<100>
1
30
650
700
Prime
SSP w/Std. Notch
HS19222
5
6"
P
<100>off
1
30
700
750
Lapped
w/Primary Flat Only
HS37809
50
6"
P
<100>
1
100
600
700
6" P <100> 1-100 ohm-cm 600-700µm Thick SSP with 10,000 A°± 5% Thermal Oxide
HS77723
2
6"
P
<100>
.005
.025
390
410
Prime
SSP with Primary Flat Only & LM
WC78987
1275
6"
P
<100>
1
50
650
700
Prime
SSP w/ Primary Flat Only
72734~P1
25
6"
P
<100>
.01
.02
650
700
Prime
w/ Primary Flat Only
FP02-61160-DCT
75
6"
P
<100>
.001
.005
650
700
Prime
SSP w/Primary Flat Only & 2850A°±5% Dry Chlorinated Thermal Oxide and Forming Gas Anneal
FP02-61160
100
6"
P
<100>
.001
.005
650
700
Prime
SSP w/Primary Flat Only
HS18854-DO
100
6"
P
<100>
1
30
650
700
Prime
SSP w/Std. Notch & 500 A°±10% Dry Thermal Oxide
HS18909-LM
445
6"
P
<100>
1
30
650
700
Prime
SSP w/Std. Notch & Backside LM
3162085
6000
6"
Any
<Any>
Any
Ingot
As-grown
STK9281
4
6"
Any
<Any>
0
100
Any
Etched
Coinrolled with Primary Flat Only.
WC99755
397
6"
Any
>600
6" Any Type, Orientation, Resistivity >600µm Thick SSP Coinroll w/Primary Flat Only or Notch
FP04-9897-2
50
6"
P/B
<100>
1
10
1275
1325
Prime
w/Std. Notch
FN06-052808
4
6"
SOI
<100> >10 ohm-cm 851±5µm Thick DSP; B
>10
851±5
SOI
with Etch Cavities, Handle: N/P <100> >10 ohm-cm 851±5µm Thick DSP; BOX: 10,000A°, Device: P/N <100> 1-10 ohm-cm, 305±5µm
FN06-052820
8
6"
SOI
<100> 10-30 ohm-cm 665±5µm Thick DS
10
30
665±5
SOI
with etch cavities, Handle: P <100> 10-30 ohm-cm 665±5µm Thick DSP w/Primary Flat, Seq'l LM; Box:10,000 A°±5%, Device: N <100>1-10, 305±5µm
8" Wafer Listing
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Print 8" Listing
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Hand
IO9433
75
8"
N
<100>
10
40
675
775
8" N <100> 10-40 ohm-cm 675-775µm Thick SSP & 3,000 A° ±5% Thermal Oxide
HS49355
38
8"
N
<100>
>10
700
750
FZ
w/Std. Notch
GN16-12341
62
8"
N
<100>
>5000
700
750
FZ
>5000 ohm-cm 700-750µm Thick Prime SSP with Std. Notch
GN16-17277
300
8"
N
<100>±0.5°
8
10
700
750
FZ
8-10 ohm-cm 700-750µm Thick Prime DSP with US Std. Notch & M12 Laser Mark
IN08-11685
75
8"
N
<100>
1
30
700
750
Prime
SSP w/Std. Notch & 3,000 A° ± 10% Thermal Oxide
IN08-11860
125
8"
N
<100>
1
30
700
750
Prime
SSP w/Std. Notch
5196
50
8"
P
<100>
.001
0.5
700
750
8" P <100> .001-0.5 ohm-cm 700-750µm Thick SSP w/Std. Notch
7574-2
500
8"
P
<100>
.01
.03
675
775
8" P <100> .01-.03 ohm-cm 675-775µm Thick SSP w/Std. Notch & Poly Oxide Backseal.
BC9137
22
8"
P
<100>
10
20
705
745
8" P <100> 10-20 ohm-cm 705-745µm Thick SSP w/Semi-Std. Notch, TTV <10µm, Backside LM
HS18288
424
8"
P
<100>
0
100
675
775
Test
SSP w/Notch & 10,000 A° ±5% Thermal Oxide
WC98987
1312
8"
P
<100>
1
50
700
750
Prime
SSP w/Std. Notch & LM
BC118365
25
8"
P
<100>
1
100
700
750
8" P <100> 1-100 ohm-cm, 700-750µm Thick SSP w/Std. Notch & LaserMark.
GCR11485
25
8"
P
<100>
1
30
700
750
Prime
with Std. Notch, TTV <5µm & 10,000 A°±5% Wet Thermal Oxide
JK-11811
1499
8"
P
<100>
1
100
675
775
8" P <100> 1-100 ohm-cm 675-775µm Thick SSP with Std. Notch only.
JK-11817
1125
8"
P
<100>
1
100
675
775
Prime
with Std. Notch only & 3,000A° ±5% Thermal Oxide.
JK-82019
25
8"
P
<100>
4
6
700
750
8" P <100> 4-6 ohm-cm 700-750µm Thick SSP w/Std. Notch & LaserMark
OCR71714
48
8"
P
<100>
1
50
700
750
8" P <100> 1-50 ohm-cm 700-750µm Thick SSP with Notch, LM & 2,000 A°±5% Thermal Oxide
WC119234
300
8"
P
<100>
Any
650
750
Reclaim
SSP w/Std. Notch & LPD's <30 @ .3µm
7574-2-OX
275
8"
P
<100>
.01
.05
675
775
8" P <100> .01-.05 ohm-cm 675-775µm Thick SSP w/Std. Notch, Custom Backside LM & 3,000 A°±5% Thermal Oxide
JK-11817-OX5
100
8"
P
<100>
1
30
700
750
8" P <100> 1-30 ohm-cm 700-750µm Thick SSP with Std. Notch only, TTV <5µm & 5,000 A°±5% Wet Thermal Oxide
OP00-9833-DO
25
8"
P
<100>
1
100
700
750
8" P <100> 1-100 ohm-cm 700-750µm Thick SSP w/Std. Notch & 500 A°±10% Dry Thermal Oxide
JK-11811-OX20K
75
8"
P
<100>
1
100
700
750
8" P <100> 1-100 ohm-cm 700-750µm Thick SSP with Std. Notch only & 20,000 A°±5% Wet Thermal Oxide on both sides
OP03-11146-OX
12
8"
P
<100>
1
30
675
775
8" P <100> 1-30 ohm-cm 675-775µm Thick SSP with Std. Notch, Custom Backside LM & 3,000A°±5% Thermal Oxide
GP08-13145
1800
8"
P
<100>
1
10
635
685
DSP
Prime with Std. Notch
GP08-13489
25
8"
P
<100>
1
100
675
775
DSP
with Std. Notch, 2X LaserMark
GP08-19194
8
8"
P
<100>
1
10
645
655
DSP
Prime w/Std. Notch, TTV <1µm, BS LM
GP11-13193
25
8"
P
<111>off4°
4.5
6.5
700
750
Prime
SSP with Notch & Poly Backseal
HP01-T200R
410
8"
P
<100>
0
100
>700
Etched
Edge-rounded Coinroll w/Std. Notch
JK-11811-OX
324
8"
P
<100>
1
100
700
750
8" P <100> 1-100 ohm-cm 700-750µm Thick SSP with Std. Notch only & 3,000 A°±5% Wet Thermal Oxide on both sides
OP03-11146
2623
8"
P
<100>
1
30
725
750
8" P <100> 1-30 ohm-cm 725-750µm Thick Etch/Etch with Std. Notch
WC10103~P1
1875
8"
P
<100>
3
40
700
750
Prime
SSP w/Std. Notch
HP01-T200CR
107
8"
Any
>700
8" Any Type, Orientation, Resistivity, >700µm Thick Coinroll w/ Notch
STK99500
100
8"
P/B
<100>
1
40
980
1020
DSP
Test w/Std. Notch & LM
GA06-13634
350
8"
N/As
<100>
<.005
675
775
8" N/As <100> <.005 ohm-cm 675-775µm Thick SSP with 3,000 A°±5% Thermal Oxide
9911
375
8"
P/Bo
<100>
>10
700
750
DSP
Prime w/ STD. Notch TTV <5µm, Oi <12 ppma, B&W <30µm
GC19195
264
8"
P/Bo
<100>
0
100
675
775
8" P/Bo <100> 0-100 ohm-cm 675-775µm Thick SSP with Std. Notch & Custom Backside LM
9911-OX5
25
8"
P/Bo
<100>
10
30
700
750
DSP
Prime w/ STD. Notch TTV <5µm, Oi <12 ppma, B&W <30µm, & 5,000A°±5% Thermal Oxide
GP26-12991
25
8"
P/Bo
<100>
>1000
710
740
Prime
SSP MCZ w/Semi-std Notch and Low Oxygen (<12ppma) & Low Carbon. FS by SEH.
HS18590
25
8"
P/Un
<100>
0
0.1
725±25
8" P/Un <100> 0-0.1 ohm-cm 725±25µm Thick SSP EPI Undoped 1-32 ohm-cm w/Std. Notch
HBF-11226
363
8"
Glass
1100
DSP
Wafer w/ Notch
8U0-19612
25
8"
Undoped
<100>
1
9999
700
750
8" Undoped <100> CZ 1-9999 ohm-cm 700-750µm SSP w/Std. Notch
12" Wafer Listing
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Hand
STK9754
215
12"
P
<100>
1
100
750
800
DSP
w/Std Notch & LM
STK9754-OX
25
12"
P
<100>
1
100
750
800
DSP
w/Std Notch, LM & 3,000 A°±5% Wet Thermal Oxide
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