Silicon Wafer Materials

Silicon wafers are a matter of precision work. Silicon wafers form the basis of the most complex electronic components — from thyristors for high-voltage applications, through low-ohm circuit elements in automotive engineering and telecommunications, to large-scale integrated microprocessors and memory modules for information processing. Our longstanding cooperation and relationships with silicon wafer suppliers, which have grown over the years, have provided us with an in-depth knowledge of our customers and their requirements. Wherever possible, we strive to surpass our customers' expectations through specially tailored products and services. This strong customer orientation is reflected in a high level of appreciation and in our sound relationships with business partners. Please view our partial inventory listing or complete our Request a Quote form for NOVA to supply your needs!

We offer silicon wafer products such as:

  1"-2" Wafers
3" Wafers
4" Wafers
5" Wafers
6" Wafers
8" Wafers 		  12" Wafers
Ingot
Float Zone (FZ) Wafers
SOI (Silicon-On-Insulator) Wafers
Epi Wafers
Solar Wafers



If you see an item that you would like us to give you a quote on, check the "Add Cart" boxes. When you have all the items selected that you would like a quote for, click on the Quote Cart button. Please browse through one of our silicon wafer product categories to view our partial inventory for immediate delivery.


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NOVA offers the best competitive pricing without sacrificing quality. No order is too big or too small for us to handle. Contact Us today.






1"-2" Wafer Listing

 Top of Page Quote Cart Print 1"-2" Listing
Add   Qty on       Resistivity Thickness  
Cart Item ID Hand Diameter Type Orientation Min. Max. Min. Max. Grade
SAP-14781 5 1" Sapphire 405 455 DSP
    wafer with No Flat
A02-17534 29 1" Germanium <111> 5-40 5 40 275 325 DSP
    Wafer with 1 Std. Flat
8376 150 2" N <100> 1 10 254 305 Prime
    SSP w/Primary Flat Only
8289 525 2" P <100> 1 10 254 306 Prime
    SSP w/ Primary Flat only.
CA02-10016 38 2" N+ <100> 325 375 GaAs
    Wafer
WC11081 200 2" N/As <111>±.5° .001 .005 254 304 Prime
    SSP w/Primary Flat Only
7244-232 25 2" P/Bo <100> .001 .005 254 305
    2" P/Bo <100> .001-.005 ohm-cm 254-305µm Thick SSP w/Primary Flat Only
SAP-14996 75 2" Sapphire 405 455 DSP
    Prime Epi Ready Wafer with Primary Flat Only
SAP-16658 150 2" Sapphire 410 450 Epi
    Ready Wafer w/Primary Flat Only, TTV <10µm, Bow & Warp <=10µm, Ra =<0.3nm
A02-17983 4 2" Germanium <110>±1°, LM/Barcode Centered on Backside
    2" Germanium N/Sb <0001> 975-1025µm Thick SSP Wafer with Primary Flat Only <110>±1°, LM/Barcode Centered on Backside
HS4962210 700 2.5" N <100> .14 .25 Ingot
    Ground
 

3" Wafer Listing

 Top of Page Quote Cart Print 3" Listing
Add   Qty on       Resistivity Thickness  
Cart Item ID Hand Diameter Type Orientation Min. Max. Min. Max. Grade
BC3032 39 3" N <111> .05 .1 300 406 As-cut
    Coin-roll
7395-LM 399 3" N <100> 1 10 356 406 Prime
    SSP with Primary Flat Only, BS LM & 3,000 Ang. ±5% Thermal Oxide
BC88996 172 3" N <111>off3-4° >.01 356 406 Epi
    layer= 7.5-10 ohm-cm 20-25µm
HC40561 21 3" N <110> Any and Ge
    As-cut Edgerounded Wafer w/2 Flats
HS18229 100 3" N <100> .001 .005 355 405 Prime
    SSP w/2 Semi-Std. Flats
WC37192 25 3" N <100> >20 381 483 Test
    with Semi Flats
BC4025-LM 915 3" N <100> 1 100 275 325 DSP
    Prime with 2/ Semi-Std. Flats & Backside LM
CN01-10274 250 3" N <100>±.5° >3000 355 405 FZ
    Prime SSP w/Primary Flat Only & LM
WC37192-LM 1575 3" N <100> >20 381 483 Test
    with Semi Flats & Backside LM
WC37620-NV 250 3" N <100> 1 10 356 406 Prime
    SSP w/Primary Flat Only
BC17967 2600 3" P <111> .014 .02 Ingot
    Ground & Flatted per U.S. Stds.
WC27806 750 3" P <100> 1 10 356 406 Prime
    SSP w/2 Semi-Std Flats
7244-1272 2300 3" P <111> <10 Ingot
    Ground, Flat & Mounted
CP02-11208-OX 75 3" P <100> .001 .005 356 406 Prime
    SSP w/2 Semi-Std. Flats & 6,000 A°±5% Wet Thermal Oxide
CP01-10973 125 3" P <100> .001 .005 355 405
    3" P <100> .001-.005 ohm-cm 355-405µm Thick SSP with 1 Semi-Std. Flat
CP02-11208 350 3" P <100> .001 .005 356 406 Prime
    SSP w/2 Semi-Std. Flats
CP17-10041 10200 3" P <100> 1 10 Ingot
    Ground w/0 Flats or 2 Flats per Semi-Stds.
BC39650 257 3" N/As <111>±.5° .001 .005 355 405 Prime
    SSP w/2 Semi-Std. Flats
7244-2718-923 15900 3" N/Sb <111> .005 .05 Ingot
    As-grown Ground & Flatted
CP02-11208-OX2 50 3" P/Bo <100> .001 .005 355 405 Prime
    SSP w/2 Semi-Std. Flats & 2,000 A°±5% Wet Thermal Oxide on Both Sides
3FS-19351 50 3" Fused 350 400 DSP
    Wafer w/Primary Flat Only, TTV <10µm, Optical Clarity: Transparent to 355nm (UV) Light
SAP3-18765 50 3" Sapphire 475 525 DSP
    Wafer w/Primary Flat Only
CP15-10503 200 3" Intrinsic <100> >10,000 675 725 FZ
    >10,000 ohm-cm 675-725µm Thick Prime DSP w/Primary Flat Only, TTV <1µm & Backside LM
 

4" Wafer Listing

 Top of Page Quote Cart Print 4" Listing
Add   Qty on       Resistivity Thickness  
Cart Item ID Hand Diameter Type Orientation Min. Max. Min. Max. Grade
7280 200 4" N <111> .001 .005 490 560
    4" N <111> .001-.005 ohm-cm 490-560µm Thick SSP w/Semi Flats
7329 75 4" N <100> 1 100 500 550 DSP
    Prime w/Primary Flat Only
7329-LM 425 4" N <100> 1 100 500 550 DSP
    Prime w/Primary Flat Only & Backside LM
BC98787 25 4" N <100> .01 .02 500 550 Prime
    SSP w/2 Semi-Std. Flats
HC44002 15 4" N <111> 5 40 762 813 Ge
    As-cut Wafer
HC44003 46 4" N <111> 5 40 889 940 Ge
    As-cut Wafer
HC44004 12 4" N <Any> 5 40 1016 1067 Ge
    As-cut Coin-rolled Wafer
STK8414 1150 4" N <100> 1 10 500 550 Prime
    SSP w/2 Semi-Std. Flats
7244-4682-126A 4000 4" N <111> 1 9 Ingot
    As-grown Phosphorus doped
DN01-11604-LM 400 4" N <100> 1 20 390 410 DSP
    w/2 Semi-Std Flats & Backside LM
DN01-11604 200 4" N <100> 1 20 390 410 DSP
    w/2 Semi-Std Flats
STK9671-1-LM 243 4" N <100> 1 40 475 575 Test
    SSP w/Primary Flat only & Backside LM
STK8414-LM 300 4" N <100> 1 10 500 550 Prime
    SSP w/2 Semi-Std. Flats & Backside LM
STK8414-OX 75 4" N <100> 1 10 500 550 Prime
    SSP w/2 Semi-Std. Flats & 5000 A°±5% Wet Thermal Oxide on both sides
7358 50 4" P <100> 10 20 500 550 Prime
    SSP w/2 Semi-Std. Flats
7375 600 4" P <100> 1 25 475 575 Test
    SSP w/2 Semi-Std Flats
7871 125 4" P <100> 1 10 500 550 DSP
    w/Primary Flat Only, TTV <5µm, Bow <30µm
7375-OX 150 4" P <100> 1 25 475 575 Test
    SSP w/2 Semi-Std Flats & 10,000 A°±5% Thermal Oxide
BC77213 150 4" P <100> .01 .02 500 550 Prime
    SSP w/2 Semi-Std. Flats
BC79114 100 4" P <100> 1 10 500 550 DSP
    w/2 Semi-Std. Flats
GC38892 14087 4" P <100> 1.3 3.7 Ingot
    Ground 1Flat per U.S. Semi-Stds.
HC49138 4400 4" P <111> .0015 .0035 Ingot
    Ground, flatted & mounted
HS39626 1550 4" P <100> .001 .005 500 550 Prime
    SSP w/2 Semi-Std Flats
DP07-095 222 4" P <111>±1° .024 .045 310 330 Prime
    ER & Lapped w/Primary Flat Only
GC38892-2 7140 4" P <100> 1.3 4.1 Ingot
    Ground 2 Flats per U.S. Semi-Stds.
STK8414-2 1750 4" P <100> 1 10 500 550 Prime
    SSP w/2 Semi-Std. Flats
STK8414-2LT-OX10 74 4" P <100> 1 10 500 550 Prime
    SSP w/2 Semi-Std. Flats, TTV <5µm & 10,000 A°±5% Wet Thermal Oxide on both sides
STK8414-2-OX10 25 4" P <100> 1 10 500 550 Prime
    SSP w/2 Semi-Std. Flats & 10,000 A°±5% Wet Thermal Oxide
STK8414-2LT-OX 50 4" P <100> 1 10 500 550 Prime
    SSP w/2 Semi-Std. Flats, TTV <5µm & 5,000 A°±5% Wet Thermal Oxide on both sides
STK8414-2-OX1 25 4" P <100> 1 10 500 550 Prime
    SSP w/2 Semi-Std. Flats & 1000 A°±10% Wet Thermal Oxide on both sides
BC79114-1F 75 4" P <100> 1 10 500 550 DSP
    Prime w/Primary Flat Only
HS39626-DO 150 4" P <100> .001 .005 500 550 Prime
    SSP w/2 Semi-Std Flats & 2850 A°±5% Dry Thermal Oxide
HS39626-OX 100 4" P <100> .001 .005 500 550 Prime
    SSP w/2 Semi-Std Flats & 2850 A°±5% Dry Chlorinated Thermal Oxide and Forming Gas Anneal
HS39626-WO 225 4" P <100> .001 .005 500 550 Prime
    SSP w/2 Semi-Std Flats & 2850 A°±5% Wet Thermal Oxide
STK8414-2-LM 300 4" P <100> 1 10 500 550 Prime
    SSP w/2 Semi-Std. Flats & Backside LM
STK8414-2-OX 125 4" P <100> 1 10 500 550 Prime
    SSP w/2 Semi-Std. Flats & 5,000 A°±5% Wet Thermal Oxide on both sides
HS39626-DO9 150 4" P <100> .001 .005 500 550 Prime
    SSP w/2 Semi-Std Flats & 900 A°±10% Dry Thermal Oxide
HS39626-OX9 50 4" P <100> .001 .005 500 550 Prime
    SSP w/2 Semi-Std Flats & 900 A°±10% Dry Chlorinated Thermal Oxide and Forming Gas Anneal
STK8414-2LT 75 4" P <100> 1 10 500 550 Prime
    SSP w/2 Semi-Std. Flats, TTV <=5µm
4A01-11732 321 4" x
    4" x 4" x 0.70mm Glass Borosilicate Wafer No Bevels, Surface Quality 80/50. (Schott D-263)
HC22001 15 4" N+ <Any> .0015 .003 Any Epi
    Layer N w/Any Resistivity & Thickness
7244-6014-859 7500 4" N+ <100> Any Ingot
    As-grown, Arsenic doped, Ground & Flatted
CA04-19174 400 4" Any 475 575
    4" Any Type, Orientation & Resistivity 475-575µm Thick SSP w/2 Semi-Std. Flats, Coin Roll
4U0-19528 100 4" Undoped <100> >100 500 550 Prime
    with Primary Flat only
SAP4-18765 25 4" Sapphire 475 525 DSP
    Wafer w/Primary Flat Only
4B01-18764 50 4" Borofloat 500 550 DSP
    Wafer with Primary Flat Only
4I0-11370 100 4" Intrinsic <100> >10,000 500 550 FZ
    >10,000 ohm-cm 500-550µm Thick Prime DSP w/Primary Flat Only
4I0-11370-OXS 10 4" Intrinsic <100> >10,000 500 550 FZ
    >10,000 ohm-cm 500-550µm Thick Prime DSP w/Primary Flat Only & 2850 A°±5% Dry Chlorinated Thermal Oxide and FGA, Single Pk
4I0-11370-LM 125 4" Intrinsic <100> >10,000 500 550 FZ
    >10,000 ohm-cm 500-550µm Thick Prime DSP w/Primary Flat Only & Backside LM
4I0-11370-OX 75 4" Intrinsic <100> >10,000 500 550 FZ
    >10,000 ohm-cm 500-550µm Thick Prime DSP w/Primary Flat Only & 2850 A°±5% Dry Chlorinated Thermal Oxide and FGA
4I0-11370-LM-WO 100 4" Intrinsic <100> >10,000 500 550 FZ
    >10,000 ohm-cm 500-550µm Thick Prime DSP w/Primary Flat Only, Backside LM & 2500A±5% Wet Thermal Oxide
4I20-20015 100 4" Intrinsic <100> >20,000 500 550 FZ
    >20,000 ohm-cm 500-550µm Thick SSP Prime w/Primary Flat Only
CN02-16073 525 4" Intrinsic <100> >10,000 675 725 FZ
    >10,000 ohm-cm 675-725µm Thick DSP Prime w/Primary Flat Only, TTV <1µm & Backside LM.
 

5" Wafer Listing

 Top of Page Quote Cart Print 5" Listing
Add   Qty on       Resistivity Thickness  
Cart Item ID Hand Diameter Type Orientation Min. Max. Min. Max. Grade
WC67391F 74 5" N <111> >20 215 230 FZ
    >20 ohm-cm 215-230µm Thick SSP
7244-6013-427 2535 5" N+ <111> <=.007 Ingot
    Ground, Flatted & Mounted, Arsenic doped
7244-6013-633 20524 5" N+ <111> .001 .01 Ingot
    As-grown Arsenic doped with 3 Flats
 

6" Wafer Listing

 Top of Page Quote Cart Print 6" Listing
Add   Qty on       Resistivity Thickness  
Cart Item ID Hand Diameter Type Orientation Min. Max. Min. Max. Grade
FA01-9900 4 6" x.75mm Pyrex
    Transparent wafers with Edge Seam, Round No Flat
HS18158 225 6" N <100> 1 10 650 700
    6" N <100> 1-10 ohm-cm 650-700µm Thick SSP w/Primary Flat Only
WC109484 1500 6" N <110> 1 10 Ingot
    Ground w/ U.S. Primary Flat Only
GC38892-5 161197 6" N <100> .025 .07396 Ingot
    Ground & 1 Flat per U.S. Semi-Stds., Antimony doped
FN06-10733-OXN 50 6" N <100> 1 10 600 700 Prime
    SSP w/Primary Flat Only, LM, 10,000 A° WTO & 4,000 A° Stoichiometric LPCVD Nitride
BC107171~XL~P1 100 6" N <100> 1 3 495 505 DSP
    Prime w/Std. Primary Flat Only, TTV <2µm, Backside LM
FN06-10733 250 6" N <100> 1 20 650 700 Prime
    SSP w/Primary Flat Only
7460 75 6" P <100> 1 20 650 700 DSP
    w/Primary Flat Only
7467 25 6" P <100> 1 50 600 700
    6" P <100> 1-50 ohm-cm 600-700µm Thick SSP w/Primary Flat Only & 3,000 A°±5% Thermal Oxide
BC2234 175 6" P <100> 1 100 600 700 Prime
    SSP w/Primary Flat Only, LM Optional & 750 A°±10% Thermal Oxide
C2TC017 575 6" P <100> 1 100 Test
    SSP w/ Primary Flat Only.
GC19060 825 6" P <100> 10 30 650 700 Prime
    SSP w/Primary Flat Only
HS18909 775 6" P <100> 1 30 650 700 Prime
    SSP w/Std. Notch
HS19222 5 6" P <100>off 1 30 700 750 Lapped
    w/Primary Flat Only
HS37809 50 6" P <100> 1 100 600 700
    6" P <100> 1-100 ohm-cm 600-700µm Thick SSP with 10,000 A°± 5% Thermal Oxide
HS77723 2 6" P <100> .005 .025 390 410 Prime
    SSP with Primary Flat Only & LM
WC78987 1225 6" P <100> 1 50 650 700 Prime
    SSP w/ Primary Flat Only
72734~P1 25 6" P <100> .01 .02 650 700 Prime
    w/ Primary Flat Only
FP02-61160-DCT 50 6" P <100> .001 .005 650 700 Prime
    SSP w/Primary Flat Only & 2850A°±5% Dry Chlorinated Thermal Oxide and Forming Gas Anneal
FP02-61160-DO 100 6" P <100> .001 .005 650 700 Prime
    SSP w/Primary Flat Only & 2850 A°±5% Dry Thermal Oxide
FP02-61160 225 6" P <100> .001 .005 650 700 Prime
    SSP w/Primary Flat Only
HS18854-DO 100 6" P <100> 1 30 650 700 Prime
    SSP w/Std. Notch & 500 A°±10% Dry Thermal Oxide
HS18909-LM 320 6" P <100> 1 30 650 700 Prime
    SSP w/Std. Notch & Backside LM
3162085 6000 6" Any <Any> Any Ingot
    As-grown
STK9281 4 6" Any <Any> 0 100 Any Etched
    Coinrolled with Primary Flat Only.
WC99755 397 6" Any >600
    6" Any Type, Orientation, Resistivity >600µm Thick SSP Coinroll w/Primary Flat Only or Notch
FN06-052808 4 6" SOI <100> >10 ohm-cm 851±5µm Thick DSP; B >10 851±5 SOI
    with Etch Cavities, Handle: N/P <100> >10 ohm-cm 851±5µm Thick DSP; BOX: 10,000A°, Device: P/N <100> 1-10 ohm-cm, 305±5µm
FN06-052820 8 6" SOI <100> 10-30 ohm-cm 665±5µm Thick DS 10 30 665±5 SOI
    with etch cavities, Handle: P <100> 10-30 ohm-cm 665±5µm Thick DSP w/Primary Flat, Seq'l LM; Box:10,000 A°±5%, Device: N <100>1-10, 305±5µm
 

8" Wafer Listing

 Top of Page Quote Cart Print 8" Listing
Add   Qty on       Resistivity Thickness  
Cart Item ID Hand Diameter Type Orientation Min. Max. Min. Max. Grade
IO9433 75 8" N <100> 10 40 675 775
    8" N <100> 10-40 ohm-cm 675-775µm Thick SSP & 3,000 A° ±5% Thermal Oxide
HS49355 25 8" N <100> >10 700 750 FZ
    w/Std. Notch
GN16-12341 62 8" N <100> >5000 700 750 FZ
    >5000 ohm-cm 700-750µm Thick Prime SSP with Std. Notch
GN16-17277 300 8" N <100>±0.5° 8 10 700 750 FZ
    8-10 ohm-cm 700-750µm Thick Prime DSP with US Std. Notch & M12 Laser Mark
IN08-11685 75 8" N <100> 1 30 700 750 Prime
    SSP w/Std. Notch & 3,000 A° ± 10% Thermal Oxide
IN08-11860 125 8" N <100> 1 30 700 750 Prime
    SSP w/Std. Notch
5196 50 8" P <100> .001 0.5 700 750
    8" P <100> .001-0.5 ohm-cm 700-750µm Thick SSP w/Std. Notch
BC9137 22 8" P <100> 10 20 705 745
    8" P <100> 10-20 ohm-cm 705-745µm Thick SSP w/Semi-Std. Notch, TTV <10µm, Backside LM
HS18288 199 8" P <100> 0 100 675 775 Test
    SSP w/Notch & 10,000 A° ±5% Thermal Oxide
WC98987 1312 8" P <100> 1 50 700 750 Prime
    SSP w/Std. Notch & LM
BC118365 25 8" P <100> 1 100 700 750
    8" P <100> 1-100 ohm-cm, 700-750µm Thick SSP w/Std. Notch & LaserMark.
GCR11485 125 8" P <100> 1 30 700 750 Prime
    with Std. Notch, TTV <5µm & 10,000 A°±5% Wet Thermal Oxide
JK-11811 1499 8" P <100> 1 100 675 775
    8" P <100> 1-100 ohm-cm 675-775µm Thick SSP with Std. Notch only.
JK-11817 1125 8" P <100> 1 100 675 775 Prime
    with Std. Notch only & 3,000A° ±5% Thermal Oxide.
JK-82019 25 8" P <100> 4 6 700 750
    8" P <100> 4-6 ohm-cm 700-750µm Thick SSP w/Std. Notch & LaserMark
OCR71714 48 8" P <100> 1 50 700 750
    8" P <100> 1-50 ohm-cm 700-750µm Thick SSP with Notch, LM & 2,000 A°±5% Thermal Oxide
WC119234 300 8" P <100> Any 650 750 Reclaim
    SSP w/Std. Notch & LPD's <30 @ .3µm
7574-2-OX 775 8" P <100> .01 .05 675 775
    8" P <100> .01-.05 ohm-cm 675-775µm Thick SSP w/Std. Notch, Custom Backside LM & 3,000 A°±5% Thermal Oxide
JK-11817-OX5 100 8" P <100> 1 30 700 750
    8" P <100> 1-30 ohm-cm 700-750µm Thick SSP with Std. Notch only, TTV <5µm & 5,000 A°±5% Wet Thermal Oxide
OP00-9833-DO 175 8" P <100> 1 100 700 750
    8" P <100> 1-100 ohm-cm 700-750µm Thick SSP w/Std. Notch & 500 A°±10% Dry Thermal Oxide
JK-11811-OX20K 50 8" P <100> 1 100 700 750
    8" P <100> 1-100 ohm-cm 700-750µm Thick SSP with Std. Notch only & 20,000 A°±5% Wet Thermal Oxide on both sides
OP03-11146-OX 1273 8" P <100> 1 30 675 775
    8" P <100> 1-30 ohm-cm 675-775µm Thick SSP with Std. Notch, Custom Backside LM & 3,000A°±5% Thermal Oxide
GP08-13145 1800 8" P <100> 1 10 635 685 DSP
    Prime with Std. Notch
GP08-13489 25 8" P <100> 1 100 675 775 DSP
    with Std. Notch, 2X LaserMark
GP08-19194 8 8" P <100> 1 10 645 655 DSP
    Prime w/Std. Notch, TTV <1µm, BS LM
GP11-13193 25 8" P <111>off4° 4.5 6.5 700 750 Prime
    SSP with Notch & Poly Backseal
HP01-T200R 410 8" P <100> 0 100 >700 Etched
    Edge-rounded Coinroll w/Std. Notch
JK-11811-OX 324 8" P <100> 1 100 700 750
    8" P <100> 1-100 ohm-cm 700-750µm Thick SSP with Std. Notch only & 3,000 A°±5% Wet Thermal Oxide on both sides
OP03-11146 287 8" P <100> 1 30 725 750
    8" P <100> 1-30 ohm-cm 725-750µm Thick Etch/Etch with Std. Notch
WC10103~P1 2700 8" P <100> 3 40 700 750 Prime
    SSP w/Std. Notch
HP01-T200CR 107 8" Any >700
    8" Any Type, Orientation, Resistivity, >700µm Thick Coinroll w/ Notch
STK99500 100 8" P/B <100> 1 40 980 1020 DSP
    Test w/Std. Notch & LM
GA06-13634 350 8" N/As <100> <.005 675 775
    8" N/As <100> <.005 ohm-cm 675-775µm Thick SSP with 3,000 A°±5% Thermal Oxide
9911 1000 8" P/Bo <100> >10 700 750 DSP
    Prime w/ STD. Notch TTV <5µm, Oi <12 ppma, B&W <30µm
GC19195 1139 8" P/Bo <100> 0 100 675 775
    8" P/Bo <100> 0-100 ohm-cm 675-775µm Thick SSP with Std. Notch & Custom Backside LM
9911-OX5 25 8" P/Bo <100> 10 30 700 750 DSP
    Prime w/ STD. Notch TTV <5µm, Oi <12 ppma, B&W <30µm, & 5,000A°±5% Thermal Oxide
GP26-12991 25 8" P/Bo <100> >1000 710 740 Prime
    SSP MCZ w/Semi-std Notch and Low Oxygen (<12ppma) & Low Carbon. FS by SEH.
HS18590 25 8" P/Un <100> 0 0.1 725±25
    8" P/Un <100> 0-0.1 ohm-cm 725±25µm Thick SSP EPI Undoped 1-32 ohm-cm w/Std. Notch
HBF-11226 363 8" Glass 1100 DSP
    Wafer w/ Notch
8U0-19612 25 8" Undoped <100> 1 9999 700 750
    8" Undoped <100> CZ 1-9999 ohm-cm 700-750µm SSP w/Std. Notch
 

12" Wafer Listing

 Top of Page Quote Cart Print 12" Listing
Add   Qty on       Resistivity Thickness  
Cart Item ID Hand Diameter Type Orientation Min. Max. Min. Max. Grade
STK9754 190 12" P <100> 1 100 750 800 DSP
    w/Std Notch & LM
STK9754-OX 25 12" P <100> 1 100 750 800 DSP
    w/Std Notch, LM & 3,000 A°±5% Wet Thermal Oxide
 

Ingot Wafer Listing

 Top of Page Quote Cart Print Ingot Listing
Add   Qty on       Resistivity Thickness  
Cart Item ID Hand Diameter Type Orientation Min. Max. Min. Max. Grade
HS4962210 700 2.5" N <100> .14 .25 Ingot
    Ground
BC17967 2600 3" P <111> .014 .02 Ingot
    Ground & Flatted per U.S. Stds.
7244-1272 2300 3" P <111> <10 Ingot
    Ground, Flat & Mounted
CP17-10041 10200 3" P <100> 1 10 Ingot
    Ground w/0 Flats or 2 Flats per Semi-Stds.
7244-2718-923 15900 3" N/Sb <111> .005 .05 Ingot
    As-grown Ground & Flatted
7244-4682-126A 4000 4" N <111> 1 9 Ingot
    As-grown Phosphorus doped
GC38892 14087 4" P <100> 1.3 3.7 Ingot
    Ground 1Flat per U.S. Semi-Stds.
HC49138 4400 4" P <111> .0015 .0035 Ingot
    Ground, flatted & mounted
GC38892-2 7140 4" P <100> 1.3 4.1 Ingot
    Ground 2 Flats per U.S. Semi-Stds.
7244-6014-859 7500 4" N+ <100> Any Ingot
    As-grown, Arsenic doped, Ground & Flatted
7244-6013-427 2535 5" N+ <111> <=.007 Ingot
    Ground, Flatted & Mounted, Arsenic doped
7244-6013-633 20524 5" N+ <111> .001 .01 Ingot
    As-grown Arsenic doped with 3 Flats
WC109484 1500 6" N <110> 1 10 Ingot
    Ground w/ U.S. Primary Flat Only
GC38892-5 161197 6" N <100> .025 .07396 Ingot
    Ground & 1 Flat per U.S. Semi-Stds., Antimony doped
3162085 6000 6" Any <Any> Any Ingot
    As-grown
 

Float Zone Wafer Listing

 Top of Page Quote Cart Print Float Zone Listing
Add   Qty on       Resistivity Thickness  
Cart Item ID Hand Diameter Type Orientation Min. Max. Min. Max. Grade
CN01-10274 250 3" N <100>±.5° >3000 355 405 FZ
    Prime SSP w/Primary Flat Only & LM
CP15-10503 200 3" Intrinsic <100> >10,000 675 725 FZ
    >10,000 ohm-cm 675-725µm Thick Prime DSP w/Primary Flat Only, TTV <1µm & Backside LM
4I0-11370 100 4" Intrinsic <100> >10,000 500 550 FZ
    >10,000 ohm-cm 500-550µm Thick Prime DSP w/Primary Flat Only
4I0-11370-OXS 10 4" Intrinsic <100> >10,000 500 550 FZ
    >10,000 ohm-cm 500-550µm Thick Prime DSP w/Primary Flat Only & 2850 A°±5% Dry Chlorinated Thermal Oxide and FGA, Single Pk
4I0-11370-LM 125 4" Intrinsic <100> >10,000 500 550 FZ
    >10,000 ohm-cm 500-550µm Thick Prime DSP w/Primary Flat Only & Backside LM
4I0-11370-OX 75 4" Intrinsic <100> >10,000 500 550 FZ
    >10,000 ohm-cm 500-550µm Thick Prime DSP w/Primary Flat Only & 2850 A°±5% Dry Chlorinated Thermal Oxide and FGA
4I0-11370-LM-WO 100 4" Intrinsic <100> >10,000 500 550 FZ
    >10,000 ohm-cm 500-550µm Thick Prime DSP w/Primary Flat Only, Backside LM & 2500A±5% Wet Thermal Oxide
4I20-20015 100 4" Intrinsic <100> >20,000 500 550 FZ
    >20,000 ohm-cm 500-550µm Thick SSP Prime w/Primary Flat Only
CN02-16073 525 4" Intrinsic <100> >10,000 675 725 FZ
    >10,000 ohm-cm 675-725µm Thick DSP Prime w/Primary Flat Only, TTV <1µm & Backside LM.
WC67391F 74 5" N <111> >20 215 230 FZ
    >20 ohm-cm 215-230µm Thick SSP
HS49355 25 8" N <100> >10 700 750 FZ
    w/Std. Notch
GN16-12341 62 8" N <100> >5000 700 750 FZ
    >5000 ohm-cm 700-750µm Thick Prime SSP with Std. Notch
GN16-17277 300 8" N <100>±0.5° 8 10 700 750 FZ
    8-10 ohm-cm 700-750µm Thick Prime DSP with US Std. Notch & M12 Laser Mark
 

Epi Wafer Listing

 Top of Page Quote Cart Print Epi Listing
Add   Qty on       Resistivity Thickness  
Cart Item ID Hand Diameter Type Orientation Min. Max. Min. Max. Grade
SAP-16658 150 2" Sapphire 410 450 Epi
    Ready Wafer w/Primary Flat Only, TTV <10µm, Bow & Warp <=10µm, Ra =<0.3nm
BC88996 172 3" N <111>off3-4° >.01 356 406 Epi
    layer= 7.5-10 ohm-cm 20-25µm
HC22001 15 4" N+ <Any> .0015 .003 Any Epi
    Layer N w/Any Resistivity & Thickness
 
 

SOI (Silicon-On-Insulator) Wafer Listing

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SOI material is used widely in applications such as telecommunication products and optical devices, dielectrically isolated integrated circuits, solid state relays and micro-machined components for sensors and actuators.

NOVA offers an innovative and powerful through-wafer interconnect technology which can allow device designers in both standard IC and MEMS device industries overcome packaging problems associated with their designs. NOVA offers a fully customized engineered substrate solution to minimize your fabrication headaches.

Typical Diameters range from 4" to 300mm. Please complete our Request a Quote form with your specifications so NOVA can quote your needs!
 
 

Epitaxial Wafer Listing

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Epitaxial silicon wafers are made through the precipitation of a monocrystalline silicon coat. The substratum consists of a polished silicon wafer.

Epitaxial wafers are used for discrete applications and, because of their extraordinary quality as semiconductors, for the manufacturing of the most progressive and highly integrated semiconductor construction elements (ICs).

Typical Diameters range from 3" to 300mm. Please complete our Request a Quote form with your specifications so NOVA can quote your needs!
 
 

Solar Wafer Listing

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NOVA creates significant competitive advantages, in terms of cost and quality, which are passed through the value chain of the entire silicon-based solar cell manufacturing market. The resulting single crystal wafers are manufactured and sold to meet the growing demands of the photovoltaic industry's major solar cell and module manufacturers, helping to further satisfy rapidly expanding end-user demand currently growing by 35 percent per year. Because NOVA's sources are designed for very high volume materials handling, as opposed to traditional precision semiconductor manufacturing that has been used to service the photovoltaic industry's silicon wafer needs in the past, NOVA can allow far better utilization of raw silicon feedstock at significantly lower cost within the supply chain.

Typical Diameters range from 3" to 125mm psuedo square to 300mm. Please contact NOVA's specialist or complete our Request a Quote form with your specifications so NOVA can quote your needs!