1"-2" Wafer Listing
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SAP-14781
5
1"
Sapphire
405
455
DSP
wafer with No Flat
A02-17534
29
1"
Germanium
<111> 5-40
5
40
275
325
DSP
Wafer with 1 Std. Flat
8376
100
2"
N
<100>
1
10
254
305
Prime
SSP w/Primary Flat Only
8289
525
2"
P
<100>
1
10
254
306
Prime
SSP w/ Primary Flat only.
8289-OX
13
2"
P
<100>
1
10
254
306
Prime
SSP w/ Primary Flat only , Backside 2D Barcode Laser Mark & 3500 A° Thermal Oxide
CA02-10016
38
2"
N+
<100>
325
375
GaAs
Wafer
CA03-12715
11
2"
SI
<100>
325
375
GaAs
Wafer
WC11081
50
2"
N/As
<111>±.5°
.001
.005
254
304
Prime
SSP w/Primary Flat Only
SAP-14996
75
2"
Sapphire
405
455
DSP
Prime Epi Ready Wafer with Primary Flat Only
SAP-16658
150
2"
Sapphire
410
450
Epi
Ready Wafer w/Primary Flat Only, TTV <10µm, Bow & Warp <=10µm, Ra =<0.3nm
A02-17983
4
2"
Germanium
<001> 975-102
975
1025
2" Germanium C Plane <001> 975-1025µm Thick SSP Wafer with Primary Flat Only <110>±1°, LM/Barcode Centered on Backside
HS4962210
700
2.5"
N
<100>
.14
.25
Ingot
Ground
3" Wafer Listing
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7395
24
3"
N
<100>
1
10
356
406
Prime
SSP with Primary Flat Only & 3,000 Ang. ±5% Thermal Oxide
BC3032
39
3"
N
<111>
.05
.1
300
406
As-cut
Coin-roll
7395-LM
450
3"
N
<100>
1
10
356
406
Prime
SSP with Primary Flat Only, BS LM & 3,000 Ang. ±5% Thermal Oxide
BC88996
172
3"
N
<111>off3-4°
>.01
356
406
Epi
layer= 7.5-10 ohm-cm 20-25µm
HC40561
21
3"
N
<110>
Any
and
Ge
As-cut Edgerounded Wafer w/2 Flats
WC37192
25
3"
N
<100>
>20
381
483
Test
with Semi Flats
BC4025-LM
265
3"
N
<100>
1
100
275
325
DSP
Prime with 2/ Semi-Std. Flats & Backside LM
CN01-10274
450
3"
N
<100>±.5°
>3000
355
405
FZ
Prime SSP w/Primary Flat Only & LM
WC37192-LM
1175
3"
N
<100>
>20
381
483
Test
with Semi Flats & Backside LM
WC37620-NV
525
3"
N
<100>
1
10
356
406
Prime
SSP w/Primary Flat Only
BC17967
2600
3"
P
<111>
.014
.02
Ingot
Ground & Flatted per U.S. Stds.
WC27806
475
3"
P
<100>
1
10
356
406
Prime
SSP w/2 Semi-Std Flats
7244-1272
2300
3"
P
<111>
<10
Ingot
Ground, Flat & Mounted
CP02-11208-OX
75
3"
P
<100>
.001
.005
356
406
Prime
SSP w/2 Semi-Std. Flats & 6,000 A°±5% Wet Thermal Oxide
CP01-10973
150
3"
P
<100>
.001
.005
355
405
3" P <100> .001-.005 ohm-cm 355-405µm Thick SSP with 1 Semi-Std. Flat
CP02-11208
650
3"
P
<100>
.001
.005
356
406
Prime
SSP w/2 Semi-Std. Flats
CP17-10041
10200
3"
P
<100>
1
10
Ingot
Ground w/0 Flats or 2 Flats per Semi-Stds.
BC39650
282
3"
N/As
<111>±.5°
.001
.005
355
405
Prime
SSP w/2 Semi-Std. Flats
7244-2718-923
15900
3"
N/Sb
<111>
.005
.05
Ingot
As-grown Ground & Flatted
CP02-11208-OX2
25
3"
P/Bo
<100>
.001
.005
355
405
Prime
SSP w/2 Semi-Std. Flats & 2,000 A°±5% Wet Thermal Oxide on Both Sides
SAP3-18765
50
3"
Sapphire
475
525
DSP
Wafer w/Primary Flat Only
CP15-10503
55
3"
Intrinsic
<100>
>10,000
675
725
FZ
>10,000 ohm-cm 675-725µm Thick Prime DSP w/Primary Flat Only, TTV <1µm & Backside LM
4" Wafer Listing
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7280
200
4"
N
<111>
.001
.005
490
560
4" N <111> .001-.005 ohm-cm 490-560µm Thick SSP w/Semi Flats
7329
275
4"
N
<100>
1
100
500
550
DSP
Prime w/Primary Flat Only
7329-LM
550
4"
N
<100>
1
100
500
550
DSP
Prime w/Primary Flat Only & Backside LM
BC98787
50
4"
N
<100>
.01
.02
500
550
Prime
SSP w/2 Semi-Std. Flats
HC44002
15
4"
N
<111>
5
40
762
813
Ge
As-cut Wafer
HC44003
46
4"
N
<111>
5
40
889
940
Ge
As-cut Wafer
HC44004
12
4"
N
<Any>
5
40
1016
1067
Ge
As-cut Coin-rolled Wafer
STK8414
1500
4"
N
<100>
1
10
500
550
Prime
SSP w/2 Semi-Std. Flats
7244-4682-126A
4000
4"
N
<111>
1
9
Ingot
As-grown Phosphorus doped
CN05-13248
195
4"
N
<100>
1
3
495
505
DSP
Prime w/ Std. Primary Flat only TTV <2µm with Backside LM
DN01-11604
175
4"
N
<100>
1
20
390
410
DSP
w/2 Semi-Std Flats
DN03-10624
325
4"
N
<100>
.001
.005
500
550
Prime
SSP w/2 Semi-Std. Flats
STK9671-1-LM
500
4"
N
<100>
1
40
475
575
Test
SSP w/Primary Flat only & Backside LM
STK8414-OX
125
4"
N
<100>
1
10
500
550
Prime
SSP w/2 Semi-Std. Flats & 5000 A°±5% Wet Thermal Oxide on both sides
7358
200
4"
P
<100>
10
20
500
550
Prime
SSP w/2 Semi-Std. Flats
7375
2425
4"
P
<100>
1
25
475
575
Test
SSP w/2 Semi-Std Flats
7871
125
4"
P
<100>
1
10
500
550
DSP
w/Primary Flat Only, TTV <5µm, Bow <30µm
7375-OX
125
4"
P
<100>
1
25
475
575
Test
SSP w/2 Semi-Std Flats & 10,000 A°±5% Thermal Oxide
BC77213
275
4"
P
<100>
.01
.02
500
550
Prime
SSP w/2 Flats
BC79114
300
4"
P
<100>
1
10
500
550
DSP
w/2 Semi-Std. Flats
GC38892
14087
4"
P
<100>
1.3
3.7
Ingot
Ground 1Flat per U.S. Semi-Stds.
HC49138
4400
4"
P
<111>
.0015
.0035
Ingot
Ground, flatted & mounted
HS39626
1075
4"
P
<100>
.001
.005
500
550
Prime
SSP w/2 Semi-Std Flats
DP07-095
222
4"
P
<111>±1°
.024
.045
310
330
Prime
ER & Lapped w/Primary Flat Only
SOI11000
7
4"
P
<100>
1
10
280
320
SOI
CZ Handle DSP w/o oxide, Box: 1.4-2.1µm Thermal, Device 1-10 ohm-cm 35-40µm, TTV <10µm
GC38892-2
7140
4"
P
<100>
1.3
4.1
Ingot
Ground 2 Flats per U.S. Semi-Stds.
STK8414-2
1603
4"
P
<100>
1
10
500
550
Prime
SSP w/2 Semi-Std. Flats
STK8414-2LT-OX10
124
4"
P
<100>
1
10
500
550
Prime
SSP w/2 Semi-Std. Flats, TTV <5µm & 10,000 A°±5% Wet Thermal Oxide on both sides
STK8414-2-OX10
50
4"
P
<100>
1
10
500
550
Prime
SSP w/2 Semi-Std. Flats & 10,000 A°±5% Wet Thermal Oxide
STK8414-2LT-OX
50
4"
P
<100>
1
10
500
550
Prime
SSP w/2 Semi-Std. Flats, TTV <5µm & 5,000 A°±5% Wet Thermal Oxide on both sides
HS39626-DO
25
4"
P
<100>
.001
.005
500
550
Prime
SSP w/2 Semi-Std Flats & 2850 A°±5% Dry Thermal Oxide
HS39626-OX
100
4"
P
<100>
.001
.005
500
550
Prime
SSP w/2 Semi-Std Flats & 2850 A°±5% Dry Chlorinated Thermal Oxide and Forming Gas Anneal
HS39626-WO
400
4"
P
<100>
.001
.005
500
550
Prime
SSP w/2 Semi-Std Flats & 2850 A°±5% Wet Thermal Oxide
STK8414-2-OX
50
4"
P
<100>
1
10
500
550
Prime
SSP w/2 Semi-Std. Flats & 5,000 A°±5% Wet Thermal Oxide on both sides
HS39626-DO9
125
4"
P
<100>
.001
.005
500
550
Prime
SSP w/2 Semi-Std Flats & 900 A°±10% Dry Thermal Oxide
HS39626-OX9
100
4"
P
<100>
.001
.005
500
550
Prime
SSP w/2 Semi-Std Flats & 900 A°±10% Dry Chlorinated Thermal Oxide and Forming Gas Anneal
HS39626-OXS
18
4"
P
<100>
.001
.005
500
550
Prime
w/2 Semi-Std Flats, 2850 A°±5% Dry Chlorinated Thermal Oxide & Forming Gas Anneal, Single Pack
STK8414-2LT
50
4"
P
<100>
1
10
500
550
Prime
SSP w/2 Semi-Std. Flats, TTV <=5µm
4A01-11732
321
4"
x
4" x 4" x 0.70mm Glass Borosilicate Wafer No Bevels, Surface Quality 80/50. (Schott D-263)
HC22001
15
4"
N+
<Any>
.0015
.003
Any
Epi
Layer N w/Any Resistivity & Thickness
7244-6014-859
7500
4"
N+
<100>
Any
Ingot
As-grown, Arsenic doped, Ground & Flatted
CA04-19174
400
4"
Any
475
575
4" Any Type, Orientation & Resistivity 475-575µm Thick SSP w/2 Semi-Std. Flats, Coin Roll
SAP4-18765
50
4"
Sapphire
475
525
DSP
Wafer w/Primary Flat Only
4B01-18764
55
4"
Borofloat
500
550
DSP
Wafer with Primary Flat Only
4I0-11370
150
4"
Intrinsic
<100>
>10,000
500
550
FZ
>10,000 ohm-cm 500-550µm Thick Prime DSP w/Primary Flat Only
4I0-11370-OXS
25
4"
Intrinsic
<100>
>10,000
500
550
FZ
>10,000 ohm-cm 500-550µm Thick Prime DSP w/Primary Flat Only & 2850 A°±5% Dry Chlorinated Thermal Oxide and FGA, Single Pk
4I0-11370-LM
222
4"
Intrinsic
<100>
>10,000
500
550
FZ
>10,000 ohm-cm 500-550µm Thick Prime DSP w/Primary Flat Only & Backside LM
4I0-11370-OX
25
4"
Intrinsic
<100>
>10,000
500
550
FZ
>10,000 ohm-cm 500-550µm Thick Prime DSP w/Primary Flat Only & 2850 A°±5% Dry Chlorinated Thermal Oxide and FGA
CN02-16073
200
4"
Intrinsic
<100>
>10,000
675
725
FZ
>10,000 ohm-cm 675-725µm Thick DSP Prime w/Primary Flat Only, TTV <1µm & Backside LM.
5" Wafer Listing
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WC67391F
74
5"
N
<111>
>20
215
230
FZ
>20 ohm-cm 215-230µm Thick SSP
7244-6013-427
2535
5"
N+
<111>
<=.007
Ingot
Ground, Flatted & Mounted, Arsenic doped
7244-6013-633
20524
5"
N+
<111>
.001
.01
Ingot
As-grown Arsenic doped with 3 Flats
6" Wafer Listing
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FA01-9900
4
6"
x.75mm
Pyrex
Transparent wafers with Edge Seam, Round No Flat
HS18158
225
6"
N
<100>
1
10
650
700
6" N <100> 1-10 ohm-cm 650-700µm Thick SSP w/Primary Flat Only
WC109484
1500
6"
N
<110>
1
10
Ingot
Ground w/ U.S. Primary Flat Only
GC38892-5
161197
6"
N
<100>
.025
.07396
Ingot
Ground & 1 Flat per U.S. Semi-Stds., Antimony doped
HS39560-2
25
6"
N
<100>
>1000
1143
1169
FZ
>1000 ohm-cm 1143-1169µm Thick DSP w/Primary Flat Only
FN06-10733-OXN
50
6"
N
<100>
1
10
600
700
Prime
SSP w/Primary Flat Only, LM, 10,000 A° WTO & 4,000 A° Stoichiometric LPCVD Nitride
BC107171~XL~P1
175
6"
N
<100>
1
3
495
505
DSP
Prime w/Std. Primary Flat Only, TTV <2µm, Backside LM
FN06-10733
175
6"
N
<100>
1
20
650
700
Prime
SSP w/Primary Flat Only
7460
100
6"
P
<100>
1
20
650
700
DSP
w/Primary Flat Only
7467
100
6"
P
<100>
1
50
600
700
6" P <100> 1-50 ohm-cm 600-700µm Thick SSP w/Primary Flat Only & 3,000 A°±5% Thermal Oxide
BC2234
175
6"
P
<100>
1
100
600
700
Prime
SSP w/Primary Flat Only, LM Optional & 750 A°±10% Thermal Oxide
BC87992
98
6"
P
<100>
1
100
600
700
Test
SSP w/Primary Flat Only & 20,000 A° ± 5% Thermal Oxide
C2TC017
1100
6"
P
<100>
1
100
Test
SSP w/ Primary Flat Only.
GC19060
150
6"
P
<100>
10
30
650
700
Prime
SSP w/Primary Flat Only
HS18730
23
6"
P
<100>
20
30
600
655
6" P <100> 20-30 ohm-cm 600-655µm Thick SSP w/Primary Flat Only
HS18909
500
6"
P
<100>
1
30
650
700
Prime
SSP w/Std. Notch
HS19222
5
6"
P
<100>off
1
30
700
750
Lapped
w/Primary Flat Only
HS37809
150
6"
P
<100>
1
100
600
700
6" P <100> 1-100 ohm-cm 600-700µm Thick SSP with 10,000 A°± 5% Thermal Oxide
HS77723
2
6"
P
<100>
.005
.025
390
410
Prime
SSP with Primary Flat Only & LM
WC78987
1675
6"
P
<100>
1
50
650
700
Prime
SSP w/ Primary Flat Only
FP02-61160-DO
25
6"
P
<100>
.001
.005
650
700
Prime
SSP w/Primary Flat Only & 2850 A°±5% Dry Thermal Oxide
FP02-61160
275
6"
P
<100>
.001
.005
650
700
Prime
SSP w/Primary Flat Only
FP04-10107
25
6"
P
<100>
0
100
600
700
Test
SSP w/ Notch Only & 3,000 Ang. ± 5% Thermal Oxide
HS18854-DO
100
6"
P
<100>
1
30
650
700
Prime
SSP w/Std. Notch & 500 A°±10% Dry Thermal Oxide
HS18909-LM
170
6"
P
<100>
1
30
650
700
Prime
SSP w/Std. Notch & Backside LM
3162085
6000
6"
Any
<Any>
Any
Ingot
As-grown
STK9281
4
6"
Any
<Any>
0
100
Any
Etched
Coinrolled with Primary Flat Only.
WC99755
462
6"
Any
>600
6" Any Type, Orientation, Resistivity >600µm Thick SSP Coinroll w/Primary Flat Only or Notch
FN06-052808
4
6"
SOI
<100> >10 ohm-cm 851±5µm Thick DSP; B
>10
851±5
SOI
with Etch Cavities, Handle: N/P <100> >10 ohm-cm 851±5µm Thick DSP; BOX: 10,000A°, Device: P/N <100> 1-10 ohm-cm, 305±5µm
FN06-052820
8
6"
SOI
<100> 10-30 ohm-cm 665±5µm Thick DS
10
30
665±5
SOI
with etch cavities, Handle: P <100> 10-30 ohm-cm 665±5µm Thick DSP w/Primary Flat, Seq'l LM; Box:10,000 A°±5%, Device: N <100>1-10, 305±5µm
8" Wafer Listing
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IO9433
75
8"
N
<100>
10
40
675
775
8" N <100> 10-40 ohm-cm 675-775µm Thick SSP & 3,000 A° ±5% Thermal Oxide
GN16-12341
462
8"
N
<100>
>5000
700
750
FZ
>5000 ohm-cm 700-750µm Thick Prime SSP with Std. Notch
GN16-17277
325
8"
N
<100>±0.5°
8
10
700
750
FZ
8-10 ohm-cm 700-750µm Thick Prime DSP with US Std. Notch & M12 Laser Mark
IN08-11685
75
8"
N
<100>
1
30
700
750
Prime
SSP w/Std. Notch & 3,000 A° ± 10% Thermal Oxide
IN08-11860
125
8"
N
<100>
1
30
700
750
Prime
SSP w/Std. Notch
BC9137
80
8"
P
<100>
10
20
705
745
8" P <100> 10-20 ohm-cm 705-745µm Thick SSP w/Semi-Std. Notch, TTV <10µm, Backside LM
HS18288
400
8"
P
<100>
0
100
675
775
Test
SSP w/Notch & 10,000 A° ±5% Thermal Oxide
WC98987
1355
8"
P
<100>
1
50
700
750
Prime
SSP w/Std. Notch & LM
BC118365
25
8"
P
<100>
1
100
700
750
8" P <100> 1-100 ohm-cm, 700-750µm Thick SSP w/Std. Notch & LaserMark.
GCR11485
25
8"
P
<100>
1
30
700
750
Prime
with Std. Notch, TTV <5µm & 10,000 A°±5% Wet Thermal Oxide
JK-11811
875
8"
P
<100>
1
100
675
775
8" P <100> 1-100 ohm-cm 675-775µm Thick SSP with Std. Notch only.
JK-11817
1825
8"
P
<100>
1
100
675
775
8" P <100> 1-100 ohm-cm 675-775µm Thick SSP with Std. Notch only & 3,000A° ±5% Thermal Oxide.
JK-82019
25
8"
P
<100>
4
6
700
750
8" P <100> 4-6 ohm-cm 700-750µm Thick SSP w/Std. Notch & LaserMark
OCR71714
48
8"
P
<100>
1
50
700
750
8" P <100> 1-50 ohm-cm 700-750µm Thick SSP with Notch, LM & 2,000 A°±5% Thermal Oxide
WC119234
300
8"
P
<100>
Any
650
750
Reclaim
SSP w/Std. Notch & LPD's <30 @ .3µm
7574-2-OX
200
8"
P
<100>
.01
.05
675
775
8" P <100> .01-.05 ohm-cm 675-775µm Thick SSP w/Std. Notch & 3,000 A°±5% Thermal Oxide
STK9500-2
75
8"
P
<100>
1
100
700
750
8" P <100> 1-100 ohm-cm 700-750µm Thick SSP w/Std. Notch
JK-11817-OX5
100
8"
P
<100>
1
30
700
750
8" P <100> 1-30 ohm-cm 700-750µm Thick SSP with Std. Notch only, TTV <5µm & 5,000 A°±5% Wet Thermal Oxide
OP00-9833-DO
100
8"
P
<100>
1
100
700
750
8" P <100> 1-100 ohm-cm 700-750µm Thick SSP w/Std. Notch & 500 A°±10% Dry Thermal Oxide
JK-11811-OX20K
100
8"
P
<100>
1
100
700
750
8" P <100> 1-100 ohm-cm 700-750µm Thick SSP with Std. Notch only & 20,000 A°±5% Wet Thermal Oxide on both sides
OP03-11146-OX
148
8"
P
<100>
1
30
675
775
8" P <100> 1-30 ohm-cm 675-775µm Thick SSP with Std. Notch & 3,000 A°±5% Thermal Oxide
GP08-13489
25
8"
P
<100>
1
100
675
775
DSP
with Std. Notch, 2X LaserMark
GP08-19194
8
8"
P
<100>
1
10
645
655
DSP
Prime w/Std. Notch, TTV <1µm, BS LM
GP11-13193
25
8"
P
<111>off4°
4.5
6.5
700
750
Prime
SSP with Notch & Poly Backseal
HP01-T200R
210
8"
P
<100>
0
100
>700
Etched
Edge-rounded Coinroll w/Std. Notch
JK-11811-OX
324
8"
P
<100>
1
100
700
750
8" P <100> 1-100 ohm-cm 700-750µm Thick SSP with Std. Notch only & 3,000 A°±5% Wet Thermal Oxide on both sides
OP03-11146
3600
8"
P
<100>
1
30
725
750
8" P <100> 1-30 ohm-cm 725-750µm Thick Etch/Etch with Std. Notch
WC10103~P1
800
8"
P
<100>
3
40
700
750
Prime
SSP w/Std. Notch
GP08-19146
500
8"
P/B
<100>
5
10
475
525
Prime
DSP w/Semi-Notch, TTV <4µm, B&W <30µm, Oi <=10 ppma, Particles <30@0.2µm, Front Side LM
GA06-13634
350
8"
N/As
<100>
<.005
675
775
8" N/As <100> <.005 ohm-cm 675-775µm Thick SSP with 3,000 A°±5% Thermal Oxide
GN11-18915
12
8"
N/Ph
<100>
5
10
475
525
Prime
DSP w/Semi Notch, TTV <4µm, Bow & Warp <30µm, LPD's <30 @ 0.2µm, Oi <=12ppma, Semi M12 LM
9911
1400
8"
P/Bo
<100>
>10
700
750
DSP
Prime w/ STD. Notch TTV <5µm, Oi <12 ppma, B&W <30µm
GC19195
168
8"
P/Bo
<100>
0
100
675
775
8" P/Bo <100> 0-100 ohm-cm 675-775µm Thick SSP with Std. Notch & Backside LM
GP26-12991
25
8"
P/Bo
<100>
>1000
710
740
Prime
SSP MCZ w/Semi-std Notch and Low Oxygen (<12ppma) & Low Carbon. FS by SEH.
HBF-11226
363
8"
Glass
1100
DSP
Wafer w/ Notch
12" Wafer Listing
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Print 12" Listing
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Hand
STK9754
90
12"
P
<100>
1
100
750
800
DSP
w/Std Notch & LM
STK9754-OX
25
12"
P
<100>
1
100
750
800
DSP
w/Std Notch, LM & 3,000 A°±5% Wet Thermal Oxide
Ingot Wafer Listing
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Print Ingot Listing
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Hand
HS4962210
700
2.5"
N
<100>
.14
.25
Ingot
Ground
BC17967
2600
3"
P
<111>
.014
.02
Ingot
Ground & Flatted per U.S. Stds.
7244-1272
2300
3"
P
<111>
<10
Ingot
Ground, Flat & Mounted
CP17-10041
10200
3"
P
<100>
1
10
Ingot
Ground w/0 Flats or 2 Flats per Semi-Stds.
7244-2718-923
15900
3"
N/Sb
<111>
.005
.05
Ingot
As-grown Ground & Flatted
7244-4682-126A
4000
4"
N
<111>
1
9
Ingot
As-grown Phosphorus doped
GC38892
14087
4"
P
<100>
1.3
3.7
Ingot
Ground 1Flat per U.S. Semi-Stds.
HC49138
4400
4"
P
<111>
.0015
.0035
Ingot
Ground, flatted & mounted
GC38892-2
7140
4"
P
<100>
1.3
4.1
Ingot
Ground 2 Flats per U.S. Semi-Stds.
7244-6014-859
7500
4"
N+
<100>
Any
Ingot
As-grown, Arsenic doped, Ground & Flatted
7244-6013-427
2535
5"
N+
<111>
<=.007
Ingot
Ground, Flatted & Mounted, Arsenic doped
7244-6013-633
20524
5"
N+
<111>
.001
.01
Ingot
As-grown Arsenic doped with 3 Flats
WC109484
1500
6"
N
<110>
1
10
Ingot
Ground w/ U.S. Primary Flat Only
GC38892-5
161197
6"
N
<100>
.025
.07396
Ingot
Ground & 1 Flat per U.S. Semi-Stds., Antimony doped
3162085
6000
6"
Any
<Any>
Any
Ingot
As-grown
Float Zone Wafer Listing
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Print Float Zone Listing
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CN01-10274
450
3"
N
<100>±.5°
>3000
355
405
FZ
Prime SSP w/Primary Flat Only & LM
CP15-10503
55
3"
Intrinsic
<100>
>10,000
675
725
FZ
>10,000 ohm-cm 675-725µm Thick Prime DSP w/Primary Flat Only, TTV <1µm & Backside LM
4I0-11370
150
4"
Intrinsic
<100>
>10,000
500
550
FZ
>10,000 ohm-cm 500-550µm Thick Prime DSP w/Primary Flat Only
4I0-11370-OXS
25
4"
Intrinsic
<100>
>10,000
500
550
FZ
>10,000 ohm-cm 500-550µm Thick Prime DSP w/Primary Flat Only & 2850 A°±5% Dry Chlorinated Thermal Oxide and FGA, Single Pk
4I0-11370-LM
222
4"
Intrinsic
<100>
>10,000
500
550
FZ
>10,000 ohm-cm 500-550µm Thick Prime DSP w/Primary Flat Only & Backside LM
4I0-11370-OX
25
4"
Intrinsic
<100>
>10,000
500
550
FZ
>10,000 ohm-cm 500-550µm Thick Prime DSP w/Primary Flat Only & 2850 A°±5% Dry Chlorinated Thermal Oxide and FGA
CN02-16073
200
4"
Intrinsic
<100>
>10,000
675
725
FZ
>10,000 ohm-cm 675-725µm Thick DSP Prime w/Primary Flat Only, TTV <1µm & Backside LM.
WC67391F
74
5"
N
<111>
>20
215
230
FZ
>20 ohm-cm 215-230µm Thick SSP
HS39560-2
25
6"
N
<100>
>1000
1143
1169
FZ
>1000 ohm-cm 1143-1169µm Thick DSP w/Primary Flat Only
GN16-12341
462
8"
N
<100>
>5000
700
750
FZ
>5000 ohm-cm 700-750µm Thick Prime SSP with Std. Notch
GN16-17277
325
8"
N
<100>±0.5°
8
10
700
750
FZ
8-10 ohm-cm 700-750µm Thick Prime DSP with US Std. Notch & M12 Laser Mark
Epi Wafer Listing
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Print Epi Listing
Qty on
Hand
SAP-16658
150
2"
Sapphire
410
450
Epi
Ready Wafer w/Primary Flat Only, TTV <10µm, Bow & Warp <=10µm, Ra =<0.3nm
BC88996
172
3"
N
<111>off3-4°
>.01
356
406
Epi
layer= 7.5-10 ohm-cm 20-25µm
HC22001
15
4"
N+
<Any>
.0015
.003
Any
Epi
Layer N w/Any Resistivity & Thickness
SOI (Silicon-On-Insulator) Wafer Listing
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SOI material is used widely in applications such as
telecommunication products and optical devices, dielectrically isolated integrated
circuits, solid state relays and micro-machined components for sensors and actuators.
NOVA offers an innovative and powerful through-wafer interconnect technology which can
allow device designers in both standard IC and MEMS device industries overcome packaging
problems associated with their designs. NOVA offers a fully customized engineered
substrate solution to minimize your fabrication headaches.
Typical Diameters range from 4" to 300mm. Please complete our
Request a Quote form with your specifications so
NOVA can quote your needs!
Epitaxial Wafer Listing
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Epitaxial silicon wafers are made through the precipitation of a
monocrystalline silicon coat. The substratum consists of a polished silicon wafer.
Epitaxial wafers are used for discrete applications and, because of their extraordinary
quality as semiconductors, for the manufacturing of the most progressive and highly
integrated semiconductor construction elements (ICs).
Typical Diameters range from 3" to 300mm. Please complete our
Request a Quote form with your specifications so
NOVA can quote your needs!
Solar Wafer Listing
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NOVA creates significant competitive advantages, in terms of cost
and quality, which are passed through the value chain of the entire silicon-based solar
cell manufacturing market. The resulting single crystal wafers are manufactured and sold
to meet the growing demands of the photovoltaic industry's major solar cell and module
manufacturers, helping to further satisfy rapidly expanding end-user demand currently
growing by 35 percent per year. Because NOVA's sources are designed for very high volume
materials handling, as opposed to traditional precision semiconductor manufacturing that
has been used to service the photovoltaic industry's silicon wafer needs in the past,
NOVA can allow far better utilization of raw silicon feedstock at significantly lower
cost within the supply chain.
Typical Diameters range from 3" to 125mm psuedo square to 300mm. Please contact NOVA's specialist or complete our
Request a Quote form with your specifications so
NOVA can quote your needs!